Frank Niklaus
Frank Niklaus
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TitelCiteras avÅr
Adhesive wafer bonding
F Niklaus, G Stemme, JQ Lu, RJ Gutmann
Journal of applied physics 99 (3), 2, 2006
5072006
MEMS-based uncooled infrared bolometer arrays: a review
F Niklaus, C Vieider, H Jakobsen
MEMS/MOEMS technologies and applications III 6836, 68360D, 2008
2672008
Low-temperature full wafer adhesive bonding
F Niklaus, P Enoksson, E Kälvesten, G Stemme
Journal of Micromechanics and Microengineering 11 (2), 100, 2001
2672001
Handbook of Silicon Based MEMS Materials and Technologies
M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ...
Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015
226*2015
Electromechanical piezoresistive sensing in suspended graphene membranes
AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ...
Nano letters 13 (7), 3237-3242, 2013
1992013
Integrating MEMS and ICs
AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ...
Microsystems & Nanoengineering 1 (1), 15005, 2015
146*2015
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels
H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme
Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001
1342001
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities
J Oberhammer, F Niklaus, G Stemme
Sensors and Actuators A: Physical 105 (3), 297-304, 2003
1252003
Low temperature full wafer adhesive bonding of structured wafers
F Niklaus, H Andersson, P Enoksson, G Stemme
Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001
1252001
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS
M Lapisa, G Stemme, F Niklaus
IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011
1152011
Method of joining components
E Kälvesten, G Stemme, F Niklaus
US Patent 7,067,345, 2006
1022006
Resistive graphene humidity sensors with rapid and direct electrical readout
AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ...
Nanoscale 7 (45), 19099-19109, 2015
942015
Encyclopedia of sensors
CA Grimes, EC Dickey, MV Pishko
American Scientific Publishers 10, 203-217, 2006
872006
Sealing of adhesive bonded devices on wafer level
J Oberhammer, F Niklaus, G Stemme
Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004
782004
Handbook of wafer bonding
P Ramm, JJQ Lu, MMV Taklo
John Wiley & Sons, 2011
752011
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure
F Niklaus, A Decharat, C Jansson, G Stemme
Infrared Physics & Technology 51 (3), 168-177, 2008
742008
Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration
F Niklaus, RJ Kumar, JJ McMahon, J Yu, JQ Lu, TS Cale, RJ Gutmann
Journal of The Electrochemical Society 153 (4), G291-G295, 2006
742006
Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding
F Niklaus, S Haasl, G Stemme
Journal of microelectromechanical systems 12 (4), 465-469, 2003
742003
Low-temperature wafer-level transfer bonding
F Niklaus, P Enoksson, P Griss, E Kalvesten, G Stemme
Journal of microelectromechanical systems 10 (4), 525-531, 2001
742001
Pressure sensors based on suspended graphene membranes
AD Smith, S Vaziri, F Niklaus, AC Fischer, M Sterner, A Delin, M Östling, ...
Solid-State Electronics 88, 89-94, 2013
652013
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Artiklar 1–20