Frank Niklaus

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Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, SwedenVerifierad e-postadress på ee.kth.se
Andreas C FischerPh.D. from KTH Royal Institute of Technology in Stockholm, SwedenVerifierad e-postadress på ee.kth.se
Niclas RoxhedAssistant Professor, KTH Royal Institute of TechnologyVerifierad e-postadress på ee.kth.se
Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of TechnologyVerifierad e-postadress på kth.se
Fredrik ForsbergKTH Royal Institute of TechnologyVerifierad e-postadress på ee.kth.se
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbHVerifierad e-postadress på eld.rwth-aachen.de
Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of TechnologyVerifierad e-postadress på kth.se
Stephan SchröderSenseairVerifierad e-postadress på senseair.com
Anderson David SmithAssociate Professor, Chalmers University of TechnologyVerifierad e-postadress på kth.se
Mikael ÖstlingKTH Royal Institute of TechnologyVerifierad e-postadress på kth.se
Xuge FanKTH Royal Institute of TechnologyVerifierad e-postadress på kth.se
Pierre EdingerPostdoctoral researcher, KTH Royal Institute of TechnologyVerifierad e-postadress på kth.se
Wim BogaertsGhent UniversityVerifierad e-postadress på ugent.be
Peter VerheyenVerifierad e-postadress på imec.be
Niels QuackThe University of SydneyVerifierad e-postadress på sydney.edu.au
Alain Yuji TakabayashiEnlightraVerifierad e-postadress på enlightra.com
tommy haraldssonCTO Mercene LabsVerifierad e-postadress på kth.se
Carlos Errando-HerranzTU DelftVerifierad e-postadress på tudelft.nl
Georg S. DuesbergChair of Sensortechnology , Universität der Bundeswehr, MunichVerifierad e-postadress på unibw.de
Anna DelinProfessor of Computational Nanomagnetism, KTH, StockholmVerifierad e-postadress på kth.se

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Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden

Verifierad e-postadress på kth.se - Startsida

MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing


Titel Sortera efter citat Sortera efter år Sortera efter titel	Citeras av Citeras av	År
Handbook of Silicon Based MEMS Materials and Technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015	751*	2015
Adhesive wafer bonding F Niklaus, G Stemme, JQ Lu, RJ Gutmann Journal of applied physics 99 (3), 2006	691	2006
MEMS-based uncooled infrared bolometer arrays: a review F Niklaus, C Vieider, H Jakobsen MEMS/MOEMS technologies and applications III 6836, 125-139, 2008	469*	2008
Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013	439	2013
Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015	354	2015
Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 15005, 2015	346	2015
Low-temperature full wafer adhesive bonding F Niklaus, P Enoksson, E Kälvesten, G Stemme Journal of Micromechanics and Microengineering 11 (2), 100, 2001	324	2001
Method of joining components E Kälvesten, G Stemme, F Niklaus US Patent 7,067,345, 2006	256	2006
Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012	175	2012
Sealing of adhesive bonded devices on wafer level J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004	167	2004
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ... Analytical chemistry 91 (2), 1578-1586, 2018	165	2018
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS M Lapisa, G Stemme, F Niklaus IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011	165	2011
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001	165	2001
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ... Nature communications 12 (1), 917, 2021	161	2021
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016	150	2016
Nanoelectromechanical sensors based on suspended 2D materials MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ... Research, 2020	144	2020
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 105 (3), 297-304, 2003	142	2003
Low temperature full wafer adhesive bonding of structured wafers F Niklaus, H Andersson, P Enoksson, G Stemme Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001	139	2001
Encyclopedia of sensors CA Grimes, EC Dickey, MV Pishko, RA Marcus (No Title), 2006	132	2006
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure F Niklaus, A Decharat, C Jansson, G Stemme Infrared Physics & Technology 51 (3), 168-177, 2008	115	2008

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