| Printed electronics for extreme high temperature environments M Alhendi, F Alshatnawi, EM Abbara, R Sivasubramony, G Khinda, ... Additive Manufacturing 54, 102709, 2022 | 30 | 2022 |
| Assessing Current‐Carrying Capacity of Aerosol Jet Printed Conductors M Alhendi, RS Sivasubramony, DL Weerawarne, J Iannotti, P Borgesen, ... Advanced Engineering Materials 22 (11), 2000520, 2020 | 23 | 2020 |
| Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors RS Sivasubramony, N Adams, M Alhendi, GS Khinda, MZ Kokash, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 896-903, 2018 | 22 | 2018 |
| A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes P Borgesen, L Wentlent, T Alghoul, R Sivasubramony, M Yadav, ... Microelectronics Reliability 95, 65-73, 2019 | 16 | 2019 |
| Effects of thermal cycling on creep of SnAgCu solder joints T Alghoul, L Wentlent, R Sivasubramony, C Greene, P Thompson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (5 …, 2018 | 15 | 2018 |
| Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex R Muralidharan, A Raj, RS Sivasubramony, M Yadav, M Alhendi, ... Journal of Materials Research 34 (16), 2903-2910, 2019 | 12 | 2019 |
| Diffusion creep of realistic SnAgCu solder joints at times and stresses of relevance to thermal fatigue T Alghoul, L Wentlent, R Sivasubramony, C Greene, P Thompson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 12 | 2019 |
| Enhanced voiding in Cu-Sn micro joints M Njuki, S Thekkut, R Sivasubramony, CM Greene, N Shahane, ... Materials Research Bulletin 150, 111759, 2022 | 11 | 2022 |
| Electromechanical characterization of a highly stretchable liquid metal derived conductor for wearable electronics B Garakani, KUS Somarathna, GS Khinda, RS Sivasubramony, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 762-768, 2021 | 10 | 2021 |
| Assessing the reliability of high temperature solder alternatives MZ Kokash, RS Sivasubramony, JLT Cuevas, AF Zamudio, P Borgesen, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1987-1995, 2017 | 9 | 2017 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 7 | 2022 |
| Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds RS Sivasubramony, MZ Kokash, S Thekkut, N Shahane, P Thompson, ... Journal of Electronic Packaging 144 (1), 011007, 2022 | 7 | 2022 |
| Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020 | 7 | 2020 |
| Laser sintering of aerosol jet printed conductive interconnects on paper substrate M Alhendi, RS Sivasubramony, J Lombardi, DL Weerawarne, P Borgesen, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1581-1587, 2019 | 7 | 2019 |
| Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds S Thekkut, MZ Kokash, RS Sivasubramony, Y Kawana, K Mirpuri, ... Journal of Electronic Packaging 144 (3), 031009, 2022 | 6 | 2022 |
| Aging and fatigue of aerosol jet-printed nano-Ag traces on flexible substrate A Raj, RS Sivasubramony, M Yadav, S Thekkut, GS Khinda, M Alhendi, ... Journal of Electronic Packaging 143 (2), 021006, 2021 | 6 | 2021 |
| Thermal Cycling – It Doesn’t Have to be a Waste of Time and Money P Borgesen, J Jiang, RS Sivasubramony, L Alvarez, T Alghoul, C Greene, ... SMTA International, 2017 | 6 | 2017 |
| Acute stress detection using recurrence quantification analysis of electroencephalogram (EEG) signals M Fan, MS Tootooni, RS Sivasubramony, V Miskovic, PK Rao, CA Chou Brain Informatics and Health: International Conference, BIH 2016, Omaha, NE …, 2016 | 6 | 2016 |
| Precision dispensed die fillets as nonconformal surfaces for printed interconnects: characterization, optimization, and mechanical performance assessment L Cestarollo, M Alhendi, RS Sivasubramony, GS Khinda, DL Weerawarne, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 5 | 2021 |
| Graph Theoretic Compressive Sensing Approach for Classification of Global Neurophysiological States from Electroencephalography (EEG) Signals MS Tootooni, M Fan, RS Sivasubramony, CA Chou, V Miskovic, PK Rao Brain Informatics and Health: International Conference, BIH 2016, Omaha, NE …, 2016 | 5 | 2016 |
Peter BorgesenProfessor of Systems Science & Industrial Engineering, Binghamton UniversityVerified email at binghamton.edu
