Test architecture for systolic array of edge-based ai accelerator US Solangi, M Ibtesam, MA Ansari, J Kim, S Park IEEE Access 9, 96700-96710, 2021 | 14 | 2021 |
Highly Efficient Test Architecture for Low-Power AI Accelerators M Ibtesam, US Solangi, J Kim, MA Ansari, S Park IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 12 | 2021 |
Reliable Test Architecture With Test Cost Reduction for Systolic-Based DNN Accelerators M Ibtesam, US Solangi, J Kim, MA Ansari, S Park IEEE Transactions on Circuits and Systems II: Express Briefs 69 (3), 1537-1541, 2021 | 5 | 2021 |
CAN-Based aging monitoring technique for automotive ASICs with efficient soft error resilience J Kim, M Ibtesam, D Kim, J Jung, S Park IEEE Access 8, 22400-22410, 2020 | 3 | 2020 |
Efficient low-power scan test method based on exclusive scan and scan chain reordering D Kim, J Kim, M Ibtesam, US Solangi, S Park Journal Of Semiconductor Technology and Science 20 (4), 390-404, 2020 | 2 | 2020 |
Time division multiplexing based test access for stacked ICs MA Ansari, US Solnagi, J Kim, AM Bughio, S Park Journal of Semiconductor Technology and Science 19 (1), 87-96, 2019 | 1 | 2019 |
Enabling test/diagnosis of automotive semiconductor chips through FlexRay network MA Ansari, AR Ansari, J Kim, S Park 2017 International Conference on Electrical and Computing Technologies and …, 2017 | 1 | 2017 |
Efficient Error-Resilient Methods for Automotive Edge Computing Systems J Kim 한양대학교, 2022 | | 2022 |
An Improved LDPC ECC based on System Level Reprogramming for MLC NAND Flash J Kim, J Jung, S Park JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE 20 (1), 63-75, 2020 | | 2020 |
Cost-efficient Chip Identification Method using Scan Flip-flop based Physically Unclonable Function D Kim, MA Ansari, J Jung, J Kim, S Park JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE 18 (2), 218-226, 2018 | | 2018 |
Test access mechanism for automotive chips through vehicular control networks J Kim, MA Ansari, D Kim, J Jung, Y Kim, S Park 2016 IEEE International Conference on Consumer Electronics-Asia (ICCE-Asia), 1-2, 2016 | | 2016 |