| Multilayer inkjet printing of millimeter-wave proximity-fed patch arrays on flexible substrates BS Cook, B Tehrani, JR Cooper, MM Tentzeris IEEE Antennas and wireless propagation letters 12, 1351-1354, 2013 | 117 | 2013 |
| Inkjet printing of multilayer millimeter-wave Yagi-Uda antennas on flexible substrates BK Tehrani, BS Cook, MM Tentzeris IEEE Antennas and Wireless Propagation Letters 15, 143-146, 2015 | 114 | 2015 |
| Additively manufactured nanotechnology and origami-enabled flexible microwave electronics JG Hester, S Kim, J Bito, T Le, J Kimionis, D Revier, C Saintsing, W Su, ... Proceedings of the IEEE 103 (4), 583-606, 2015 | 104 | 2015 |
| Inkjet-printed 3D interconnects for millimeter-wave system-on-package solutions BK Tehrani, BS Cook, MM Tentzeris 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 80 | 2016 |
| Additively manufactured RF components and modules: Toward empowering the birth of cost-efficient dense and ubiquitous IoT implementations SA Nauroze, JG Hester, BK Tehrani, W Su, J Bito, R Bahr, J Kimionis, ... Proceedings of the IEEE 105 (4), 702-722, 2017 | 66 | 2017 |
| Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate BS Cook, C Mariotti, JR Cooper, D Revier, BK Tehrani, L Aluigi, L Roselli, ... 2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014 | 64 | 2014 |
| Exploring 3-D printing for new applications: Novel inkjet-and 3-D-printed millimeter-wave components, interconnects, and systems R Bahr, B Tehrani, MM Tentzeris IEEE Microwave magazine 19 (1), 57-66, 2017 | 46 | 2017 |
| E-band characterization of 3D-printed dielectrics for fully-printed millimeter-wave wireless system packaging BK Tehrani, RA Bahr, W Su, BS Cook, MM Tentzeris 2017 IEEE MTT-S International Microwave Symposium (IMS), 1756-1759, 2017 | 44 | 2017 |
| Additively manufactured mm-wave multichip modules with fully printed “smart” encapsulation structures X He, BK Tehrani, R Bahr, W Su, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 68 (7), 2716-2724, 2019 | 42 | 2019 |
| First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017 | 38 | 2017 |
| Development, characterization, and processing of thin and thick inkjet-printed dielectric films BK Tehrani, C Mariotti, BS Cook, L Roselli, MM Tentzeris Organic Electronics 29, 135-141, 2016 | 38 | 2016 |
| Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications A Eid, X He, R Bahr, TH Lin, Y Cui, A Adeyeye, B Tehrani, MM Tentzeris IEEE Microwave Magazine 21 (12), 87-103, 2020 | 34 | 2020 |
| Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects BK Tehrani, J Bito, BS Cook, MM Tentzeris 2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014 | 32 | 2014 |
| Fully inkjet-printed ramp interconnects for wireless Ka-band MMIC devices and multi-chip module packaging BK Tehrani, MM Tentzeris 2018 48th European Microwave Conference (EuMC), 1037-1040, 2018 | 29 | 2018 |
| Novel uniquely 3D printed intricate Voronoi and fractal 3D antennas RA Bahr, Y Fang, W Su, B Tehrani, V Palazzi, MM Tentzeris 2017 IEEE MTT-S International Microwave Symposium (IMS), 1583-1586, 2017 | 23 | 2017 |
| Nanotechnology-empowered flexible printed wireless electronics: A review of various applications of printed materials A Eid, J Hester, Y Fang, B Tehrani, SA Nauroze, R Bahr, MM Tentzeris IEEE Nanotechnology Magazine 13 (1), 18-29, 2018 | 21 | 2018 |
| Fully inkjet-printed multilayer microstrip patch antenna for Ku-band applications J Bito, B Tehrani, B Cook, M Tentzeris 2014 IEEE Antennas and Propagation Society International Symposium (APSURSI …, 2014 | 20 | 2014 |
| Ultralow-loss substrate-integrated waveguides in glass-based substrates for millimeter-wave applications AO Watanabe, BK Tehrani, T Ogawa, PM Raj, MM Tentzeris, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 18 | 2020 |
| Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing BK Tehrani, BS Cook, MM Tentzeris 2015 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2015 | 17 | 2015 |
| The principles of" smart" encapsulation: using additive printing technology for the realization of intelligent application-specific packages for IoT, 5G, and automotive radar … B Tehrani, R Bahr, D Revier, B Cook, M Tentzeris 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 111-117, 2018 | 16 | 2018 |
Manos TentzerisGeorgia TechVerifierad e-postadress på ece.gatech.edu
