| Review of multiscale simulation in submicron heat transfer JY Murthy, SVJ Narumanchi, PG Jose'A, T Wang, C Ni, SR Mathur International Journal for Multiscale Computational Engineering 3 (1), 2005 | 126 | 2005 |
| Liquid-cooling memory modules with liquid flow pipes between memory module sockets RM Barina, V Kamath, C Ni, DI Schmidt, ME Steinke, JS Womble US Patent 8,587,943, 2013 | 49 | 2013 |
| User-serviceable liquid DIMM cooling system RM Barina, V Kamath, C Ni, DI Schmidt, ME Steinke, JS Womble US Patent 8,638,559, 2014 | 48 | 2014 |
| Coupled electro-thermal simulation of MOSFETs C Ni, Z Aksamija, JY Murthy, U Ravaioli International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009 | 37 | 2009 |
| Parallel computation of the phonon Boltzmann transport equation C Ni, JY Murthy Numerical Heat Transfer, Part B: Fundamentals 55 (6), 435-456, 2009 | 28 | 2009 |
| Heat sink with orientable fins DS Busch, MS June, C Ni, P Ramineni US Patent 9,507,391, 2016 | 22 | 2016 |
| Phonon transport models for heat conduction in sub-micron geometries with application to microelectronics C Ni Purdue University, 2009 | 22 | 2009 |
| Phonon transport modeling using Boltzmann transport equation with anisotropic relaxation times C Ni, JY Murthy | 21 | 2012 |
| Independently operable ionic air moving devices for zonal control of air flow through a chassis MS June, C Ni, ME Steinke US Patent 8,139,354, 2012 | 17 | 2012 |
| Heat sink with orientable fins TW Glover, C Ni, WR Scott III, ME Steinke US Patent 9,875,951, 2018 | 11 | 2018 |
| Electrostatic control of air flow to the inlet opening of an axial fan MS June, C Ni, ME Steinke US Patent 8,444,754, 2013 | 10 | 2013 |
| Sub-micron thermal transport modeling by phonon Boltzmann Transport with anisotropic relaxation times C Ni, J Murthy 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 10 | 2008 |
| Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array MS June, C Ni, DS Royer, ME Steinke US Patent 8,807,204, 2014 | 6 | 2014 |
| Electrostatic control of air flow to the inlet opening of an axial fan MS June, C Ni, ME Steinke US Patent 8,613,793, 2013 | 5 | 2013 |
| Heat sink with heat bus and fin structure TW Glover, MS June, BJ Kochuparambil, C Ni, P Ramineni, WR Scott III US Patent App. 13/307,562, 2013 | 5 | 2013 |
| Auxiliary cooling redundancy for components using actuating fan pack JS Holland, BJ Kochuparambil, V Kamath, C Ni US Patent App. 16/370,711, 2020 | 3 | 2020 |
| Thermally enhanced cold plate having high conductivity thermal transfer paths Z Huang, V Kamath, HV Mahaney Jr, C Ni, ME Steinke, JA Wakil US Patent App. 13/339,514, 2013 | 3 | 2013 |
| Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times C Ni, JY Murthy International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 2 | 2009 |
| Optimizing waste heat recovery and return water temperature using dynamic flow control based on server power profiles and cooling capacity of servers C Ni, V Kamath, JS Holland, BJ Kochuparambil, AT Junkins, P Artman US Patent 11,871,540, 2024 | | 2024 |
| Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array MS June, C Ni, DSR Adams, ME Steinke US Patent App. 14/264,092, 2014 | | 2014 |
