| Reducing error rates in straintronic multiferroic nanomagnetic logic by pulse shaping K Munira, Y Xie, S Nadri, MB Forgues, MS Fashami, J Atulasimha, ... Nanotechnology 26 (24), 245202, 2015 | 35 | 2015 |
| An epitaxy transfer process for heterogeneous integration of submillimeter-wave GaAs Schottky diodes on silicon using SU-8 L Xie, S Nadri, N Alijabbari, ME Cyberey, MF Bauwens, AW Lichtenberger, ... IEEE Electron Device Letters 38 (11), 1516-1519, 2017 | 17 | 2017 |
| Measurement and extraction of parasitic parameters of quasi-vertical schottky diodes at submillimeter wavelengths S Nadri, L Xie, M Jafari, MF Bauwens, A Arsenovic, RM Weikle IEEE Microwave and Wireless Components Letters 29 (7), 474-476, 2019 | 15 | 2019 |
| Thermal characterization of quasi-vertical GaAs Schottky diodes integrated on silicon S Nadri, CM Moore, ND Sauber, L Xie, ME Cyberey, JT Gaskins, ... IEEE Transactions on Electron Devices 66 (1), 349-356, 2018 | 9 | 2018 |
| A 160 GHz frequency Quadrupler based on heterogeneous integration of GaAs Schottky diodes onto silicon using SU-8 for epitaxy transfer S Nadri, L Xie, M Jafari, N Alijabbari, ME Cyberey, NS Barker, ... 2018 IEEE/MTT-S International Microwave Symposium-IMS, 769-772, 2018 | 9 | 2018 |
| Submillimeter-wave schottky diodes based on heterogeneous integration of GaAs onto silicon RM Weikle, L Xie, S Nadri, M Jafari, CM Moore, N Alijabbari, ME Cyberey, ... 2019 United States National Committee of URSI National Radio Science Meeting …, 2019 | 8 | 2019 |
| High-performance InGaAs/InP photodiodes on silicon using low-temperature wafer-bonding Q Yu, Y Wang, L Xie, S Nadri, K Sun, J Zang, Q Li, RM Weikle, A Beling CLEO: Science and Innovations, SM2I. 1, 2018 | 5 | 2018 |
| Steady-state thermal analysis of an integrated 160 GHz balanced quadrupler based on quasi-vertical Schottky diodes S Nadri, L Xie, N Alijabbari, JT Gaskins, BM Foley, PE Hopkins, ... 2015 40th International Conference on Infrared, Millimeter, and Terahertz …, 2015 | 5 | 2015 |
| Micromachined probes with integrated GaAs Schottky diodes for on-wafer temperature sensing L Xie, CM Moore, ME Cyberey, S Nadri, ND Sauber, MF Bauwens, ... 2018 IEEE International Instrumentation and Measurement Technology …, 2018 | 3 | 2018 |
| Micromachined interfaces for metrology and packaging applications in the submillimeter-wave band RM Weikle, H Li, A Arsenovic, S Nadri, L Xie, MF Bauwens, N Alijabbari, ... IMAPSource Proceedings 2017 (DPC), 1-36, 2017 | 3 | 2017 |
| 10μm Pitch Bumping of Singulated Die Using a Temporary Metal-Embedded Chip Assembly Process S Nadri, BAC Tu, F Herrault, C Wilt, P Naghibi, M Pavlov, J Wong, V Phan 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1000-1004, 2022 | 2 | 2022 |
| Electronic calibration for submillimeter-wave on-wafer scattering parameter measurements using Schottky diodes L Xie, MF Bauwens, S Nadri, A Arsenovic, ME Cyberey, AW Lichtenberger, ... IEEE Transactions on Terahertz Science and Technology 10 (6), 583-592, 2020 | 2 | 2020 |
| A monostatic coded aperture reflectometer for imaging at submillimeter-wavelengths MB Eller, ND Sauber, A Arsenovic, S Nadri, L Xie, RM Weikle 2017 IEEE MTT-S International Microwave Symposium (IMS), 1207-1209, 2017 | 2 | 2017 |
| An Integrated 100-element schottky varactor diode array for sideband generation at 1.6 THz S Hawasli, S Nadri, L Xie, RM Weikle 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 2 | 2016 |
| Reducing error rates in straintronic multiferroic dipole-coupled nanomagnetic logic by pulse shaping K Munira, Y Xie, S Nadri, MB Forgues, MS Fashami, J Atulasimha, ... arXiv preprint arXiv:1405.4000, 2014 | 2 | 2014 |
| System and method for integrating diode sensors on micromachined wafer probes RM Weikle, XIE Linli, ME Cyberey, S Nadri, MF Bauwens, ... US Patent App. 17/053,930, 2021 | 1 | 2021 |
| Electronic calibration of one-port networks at submillimeter wavelengths using Schottky diodes as on-wafer standards L Xie, MF Bauwens, S Nadri, ME Cyberey, A Arsenovic, AW Lichtenberger, ... 2019 93rd ARFTG Microwave Measurement Conference (ARFTG), 1-4, 2019 | 1 | 2019 |
| Terahertz diode arrays and differential probes based on heterogeneous integration and silicon micromachining RM Weikle, C Zhang, S Hawasli, S Nadri, L Xie, NS Barker, ... Additional Papers and Presentations 2016 (DPC), 000924-000962, 2016 | 1 | 2016 |
| Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging S Nadri, BAC Tu, F Herrault, H Sharifi, J McCue, A Khan, D Schwan, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 623-628, 2023 | | 2023 |
| Micro-printing of ceramic packaging for sensor integration T Schaedler, KA Porter, CY Alex, ES Wernick, S Soukiazian, T Sasse, ... Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVI …, 2023 | | 2023 |
