Dinesh Pamunuwa
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Extending systems-on-chip to the third dimension: performance, cost and technological tradeoffs
R Weerasekera, LR Zheng, D Pamunuwa, H Tenhunen
2007 IEEE/ACM International Conference on Computer-Aided Design, 212-219, 2007
1282007
Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits
R Weerasekera, M Grange, D Pamunuwa, H Tenhunen, LR Zheng
2009 IEEE International Conference on 3D System Integration, 1-8, 2009
1162009
Maximizing throughput over parallel wire structures in the deep submicrometer regime
D Pamunuwa, LR Zheng, H Tenhunen
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 11 (2), 224-243, 2003
992003
Scalability of network-on-chip communication architecture for 3-D meshes
AY Weldezion, M Grange, D Pamunuwa, Z Lu, A Jantsch, R Weerasekera, ...
2009 3rd ACM/IEEE International Symposium on Networks-on-Chip, 114-123, 2009
712009
A 6.7-GHz active gate driver for GaN FETs to combat overshoot, ringing, and EMI
HCP Dymond, J Wang, D Liu, JJO Dalton, N McNeill, D Pamunuwa, ...
IEEE Transactions on Power Electronics 33 (1), 581-594, 2017
642017
Two-dimensional and three-dimensional integration of heterogeneous electronic systems under cost, performance, and technological constraints
R Weerasekera, D Pamunuwa, LR Zheng, H Tenhunen
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2009
492009
On signalling over through-silicon via (TSV) interconnects in 3-D integrated circuits
R Weerasekera, M Grange, D Pamunuwa, H Tenhunen
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010
402010
Repeater insertion to minimise delay in coupled interconnects
D Pamunuwa, H Tenhunen
VLSI Design 2001. Fourteenth International Conference on VLSI Design, 513-517, 2001
372001
Layout, Performance and Power Trade-Offs in Mesh-Based Network-on-Chip Architectures.
D Pamunuwa, J Öberg, LR Zheng, M Millberg, A Jantsch, H Tenhunen
VLSI-SOC, 362-, 2003
292003
A study on the implementation of 2-D mesh-based networks-on-chip in the nanometre regime
D Pamunuwa, J Öberg, LR Zheng, M Millberg, A Jantsch, H Tenhunen
Integration 38 (1), 3-17, 2004
212004
Wire-bonded through-silicon vias with low capacitive substrate coupling
AC Fischer, M Grange, N Roxhed, R Weerasekera, D Pamunuwa, ...
Journal of Micromechanics and Microengineering 21 (8), 085035, 2011
202011
Accurate a priori signal integrity estimation using a multilevel dynamic interconnect model for deep submicron VLSI design
LR Zheng, D Pamunuwa, H Tenhunen
Proceedings of the 26th European Solid-State Circuits Conference, 352-355, 2000
202000
Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs).
R Weerasekera, DB Pamunuwa, M Grange, H Tenhunen, LR Zheng
182009
A global wire planning scheme for network-on-chip
J Liu, LR Zheng, D Pamunuwa, H Tenhunen
Proceedings of the 2003 International Symposium on Circuits and Systems …, 2003
182003
Bandwidth optimization for through silicon via (TSV) bundles in 3D integrated circuits.
A Weldezion, R Weerasekera, DB Pamunuwa, L Zheng, H Tenhunen
162009
Nano-crystalline graphite for reliability improvement in MEM relay contacts
S Rana, JD Reynolds, TY Ling, MS Shamsudin, SH Pu, HMH Chong, ...
Carbon 133, 193-199, 2018
152018
Shaping switching waveforms in a 650 V GaN FET bridge-leg using 6.7 GHz active gate drivers
JJO Dalton, J Wang, HCP Dymond, D Liu, D Pamunuwa, BH Stark, ...
2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 1983-1989, 2017
142017
Analytical compact model in Verilog-A for electrostatically actuated ohmic switches
A Bazigos, CL Ayala, M Fernandez-Bolanos, Y Pu, D Grogg, C Hagleitner, ...
IEEE Transactions on Electron Devices 61 (6), 2186-2194, 2014
142014
Reduction of oscillations in a GaN bridge leg using active gate driving with sub-ns resolution, arbitrary gate-resistance patterns
HCP Dymond, D Liu, J Wang, JJO Dalton, N McNeill, D Pamunuwa, ...
2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-6, 2016
132016
Energy and latency optimization in NEM relay-based digital circuits
S Rana, T Qin, A Bazigos, D Grogg, M Despont, CL Ayala, C Hagleitner, ...
IEEE Transactions on Circuits and Systems I: Regular Papers 61 (8), 2348-2359, 2014
132014
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