| A study on the bonding process of Cu bump/Sn/Cu bump bonding structure for 3D packaging applications B Lee, J Park, S Jeon, K Kwon, H Lee Journal of The Electrochemical Society 157 (4), H420, 2010 | 42 | 2010 |
| Enhanced Electrical Potential of Thermoelectric Power Waves by Sb2Te3-Coated Multiwalled Carbon Nanotube Arrays S Hong, W Kim, SJ Jeon, SC Lim, HJ Lee, S Hyun, YH Lee, S Baik The journal of physical chemistry C 117 (2), 913-917, 2013 | 32 | 2013 |
| A hybridized graphene carrier highway for enhanced thermoelectric power generation S Hong, ES Kim, W Kim, SJ Jeon, SC Lim, KH Kim, HJ Lee, S Hyun, ... Physical Chemistry Chemical Physics 14 (39), 13527-13531, 2012 | 31 | 2012 |
| Effects of post-annealing on thermoelectric properties of bismuth–tellurium thin films deposited by co-sputtering S Jeon, M Oh, H Jeon, S Hyun, H Lee Microelectronic engineering 88 (5), 541-544, 2011 | 31 | 2011 |
| Microstructure evolution of sputtered BiSb–Te thermoelectric films during post-annealing and its effects on the thermoelectric properties S Jeon, H Jeon, S Na, SD Kang, HK Lyeo, S Hyun, HJ Lee Journal of alloys and compounds 553, 343-349, 2013 | 27 | 2013 |
| Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test S Jeon, S Hyun, HJ Lee, JW Kim, SS Ha, JW Yoon, SB Jung, HJ Lee Microelectronic Engineering 85 (10), 1967-1970, 2008 | 27 | 2008 |
| Evaluation of drop reliability of Sn–37Pb solder/Cu joints using a high speed lap-shear test S Jeon, JW Kim, B Lee, HJ Lee, SB Jung, S Hyun, HJ Lee Microelectronic engineering 91, 147-153, 2012 | 20 | 2012 |
| Improvement of wafer-level Cu-to-Cu bonding quality using wet chemical pretreatment JW Kim, SJ Jeon, HJ Lee, S Hyun, YB Park Journal of Nanoscience and Nanotechnology 12 (4), 3577-3581, 2012 | 16 | 2012 |
| A study on the breakdown mechanism of an electroless-plated Ni (P) diffusion barrier for Cu/Sn/Cu 3D interconnect bonding structures B Lee, H Jeon, SJ Jeon, KW Kwon, HJ Lee Journal of electronic materials 41, 109-114, 2012 | 14 | 2012 |
| A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties M Oh, S Jeon, H Jeon, S Hyun, H Lee Journal of electronic materials 41, 60-66, 2012 | 11 | 2012 |
| Microstructure evolution of sputtered Bi-Te films during post-annealing: Phase transformation and its effects on the thermoelectric properties S Jeon, M Oh, H Jeon, SD Kang, HK Lyeo, S Hyun, H Lee Journal of The Electrochemical Society 158 (8), H808, 2011 | 11 | 2011 |
| Study on the contact resistance of various metals (Au, Ti, and Sb) on Bi–Te and Sb–Te thermoelectric films H Yong, S Na, JG Gang, HS Shin, SJ Jeon, SM Hyun, HJ Lee Japanese Journal of Applied Physics 55 (6S3), 06JE03, 2016 | 9 | 2016 |
| Effects of Sb Content (x) on (Bi1− x Sb x) 2Te3 Thermoelectric Thin Film Deposited by Effusion Cell Evaporator H Yong, S Na, JG Gang, SJ Jeon, S Hyun, HJ Lee Journal of Nanoscience and Nanotechnology 15 (10), 8251-8256, 2015 | 2 | 2015 |
| Introduction to the Thin Film Thermoelectric Cooler Design Theories SJ Jeon, B Jang, JY Song, S Hyun, HJ Lee Journal of the Korean Society for Precision Engineering 31 (10), 881-887, 2014 | | 2014 |
| Direct Measurement and Enhancement of Adhesion Energy of Bi-Te Thermoelectric Thin Films C Kim, S Jeon, HJ Lee, S Hyun, TS Kim ECS Meeting Abstracts, 2759, 2012 | | 2012 |
| A Study on the Phase Transformation and Microstructure Evolution of Sputtered Bi-Te Thermoelectric Films with Different Compositions during Post-Annealing M Oh, SJ Jeon, S Hyun, HJ Lee Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2011 | | 2011 |
| Bi-Te thermoelectric thin film for active cooling method S Hyun, S Jeon, M Oh, H Lee, HJ Lee, B Kim Proceedings of the Korean Society of Precision Engineering Conference, 551-552, 2010 | | 2010 |
| Mechanical Reliability Evaluation of Sn-37Pb/Cu and Sn-37Pb/ENIG Solder Joints by using High Speed Lap-shear Test S Jeon, S Hyun, HJ Lee, J Kim, SB Jung, HJ Lee 2008 10th Electronics Packaging Technology Conference, 516-520, 2008 | | 2008 |
| Mechanical Reliability Evaluation of Sn-37Pb Solder/Cu and Sn-37Pb Solder/ENIG Joints Using a High Speed Lap-shear Test SJ Jeon, SM Hyun, HJ Lee, HJ Lee Proceedings of the KSME Conference, 250-255, 2008 | | 2008 |
| Supplementary Information A hybridized graphene carrier highway for enhanced thermoelectric power generation S Hong, ES Kim, W Kim, SJ Jeon, SC Lim, KH Kim, HJ Lee, S Hyun, ... | | |
