Mu穆, DeKui德魁
Mu穆, DeKui德魁
Institute of manufacturing, Huaqiao University
Verifierad e-postadress på uqconnect.edu.au - Startsida
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Effect of Ni on phase stability and thermal expansion of Cu6− xNixSn5 (X= 0, 0.5, 1, 1.5 and 2)
K Nogita, D Mu, SD McDonald, J Read, YQ Wu
Intermetallics 26, 78-85, 2012
632012
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
DK Mu, SD McDonald, J Read, H Huang, K Nogita
Current Opinion in Solid State and Materials Science 20 (2), 55-76, 2016
612016
Anisotropic mechanical properties of Cu6Sn5 and (Cu, Ni) 6Sn5
D Mu, H Huang, K Nogita
Materials Letters 86, 46-49, 2012
552012
Thermal expansion of Cu6Sn5 and (Cu, Ni) 6Sn5
D Mu, J Read, Y Yang, K Nogita
Journal of Materials Research 26 (20), 2660, 2011
532011
Growth orientations and mechanical properties of Cu6Sn5 and (Cu, Ni) 6Sn5 on poly-crystalline Cu
D Mu, H Yasuda, H Huang, K Nogita
Journal of alloys and compounds 536, 38-46, 2012
462012
Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu, Ni) 6Sn5 on diverse crystal planes
D Mu, H Huang, SD McDonald, J Read, K Nogita
Materials Science and Engineering: A 566, 126-133, 2013
342013
The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ...
Journal of Alloys and Compounds 685, 471-482, 2016
282016
A simple route to fabricate TiC–TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air
YF Yang, DK Mu, QC Jiang
Materials Chemistry and Physics 143 (2), 480-485, 2014
282014
Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures
D Mu, H Huang, SD McDonald, K Nogita
Journal of electronic materials 42 (2), 304-311, 2013
232013
Ni segregation in the interfacial (Cu, Ni) 6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, K Nogita
Intermetallics 54, 20-27, 2014
202014
Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy
J Chen, D Mu, X Liao, G Huang, H Huang, X Xu, H Huang
International Journal of Refractory Metals and Hard Materials 74, 52-60, 2018
182018
Rapid dehydrogenation of TiH2 and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2–C system
YF Yang, DK Mu
Powder technology 249, 208-211, 2013
182013
Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints
DK Mu, H Tsukamoto, H Huang, K Nogita
Materials Science Forum 654, 2450-2454, 2010
162010
Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures
X Liao, D Mu, J Wang, G Huang, H Huang, X Xu, H Huang
International Journal of Refractory Metals and Hard Materials 66, 252-257, 2017
112017
Effect of Ni addition on the formation mechanism of Ti5Si3 during self-propagation high-temperature synthesis and mechanical property
YF Yang, D Mu
Journal of the European Ceramic Society 34 (10), 2177-2185, 2014
112014
Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy
M Li, J Chen, Q Lin, Y Wu, D Mu
Diamond and Related Materials 97, 107440, 2019
82019
Fundamental aspects of ultrasonic assisted induction brazing of diamond onto 1045 steel
G Huang, J Huang, M Zhang, D Mu, G Zhou, X Xu
Journal of Materials Processing Technology 260, 123-136, 2018
82018
Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys
X Liao, D Mu, W Fu, H Huang, H Huang
Materials & Design 182, 108039, 2019
72019
Reactive wetting of binary SnCr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures
J Chen, X Liao, Q Lin, D Mu, H Huang, X Xu, H Huang
Diamond and Related Materials 92, 92-99, 2019
72019
Low-temperature wetting of sapphire using Sn–Ti active solder alloys
D Mu, K Feng, Q Lin, H Huang
Ceramics International 45 (17), 22175-22182, 2019
62019
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Artiklar 1–20