| Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020 | 32 | 2020 |
| 2.5 D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages S Ravichandran, S Yamada, G Park, HW Chen, T Shi, C Buch, F Liu, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 625-630, 2018 | 32 | 2018 |
| Characterization of ABF/glass/ABF substrates for mmWave applications M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 31 | 2021 |
| W-band and D-band transmission lines on glass based substrates for sub-THz modules M ur Rehman, S Ravichandran, S Erdogan, M Swaminathan 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 660-665, 2020 | 23 | 2020 |
| Heterogeneous and homogeneous package integration technologies at device and system levels R Tummala, N Nedumthakady, S Ravichandran, B DeProspo, ... 2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2018 | 21 | 2018 |
| Large-body-sized glass-based active interposer for high-performance computing S Ravichandran, M Kathaperumal, M Swaminathan, R Tummala 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 879-884, 2020 | 18 | 2020 |
| Advances in high performance RDL technologies for enabling IO density of 500 IOs/mm/layer and 8-μm IO pitch using low-k dielectrics F Liu, R Zhang, BH DeProspo, S Dwarakanath, P Nimbalkar, ... 2020 IEEE 70th electronic components and technology conference (ECTC), 1132-1139, 2020 | 18 | 2020 |
| Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications S Ravichandran, S Yamada, T Ogawa, T Shi, F Liu, V Smet, V Sundaram, ... Journal of Microelectronics and Electronic Packaging 16 (3), 124-135, 2019 | 18 | 2019 |
| Fundamentals of device and systems packaging: technologies and applications R Tummala McGraw Hill Professional, 2019 | 16 | 2019 |
| Materials for heterogeneous integration M Swaminathan, M Kathaperumal, K Moon, H Sharma, P Murali, ... MRS Bulletin 46 (10), 967-977, 2021 | 11 | 2021 |
| Thermal management of glass panel embedded packages: Package architecture vs. power density R Wong, S Ravichandran, H Lee, V Smet 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2105-2106, 2020 | 11 | 2020 |
| Low-Cost 1- m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL F Liu, C Nair, H Ito, BH DeProspo, S Ravichandran, H Akimaru, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 11 | 2019 |
| Characterization of chip-to-package interconnects for glass panel embedding (GPE) for sub-THz wireless communications S Erdogan, S Ravichandran, X Jia, M Swaminathan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2328-2333, 2021 | 10 | 2021 |
| Low-cost non-tsv based 3d packaging using glass panel embedding (gpe) for power-efficient, high-bandwidth heterogeneous integration S Ravichandran, S Yamada, F Liu, V Smet, M Kathaperumal, R Tummala 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1796-1802, 2019 | 10 | 2019 |
| Attenuation of high frequency signals in structured metallization on glass: Comparing different metallization techniques with 24 GHz, 77 GHz and 100 GHz structures L Martin, J Matthias, BT Gore, WJ Kozlovsky, R Premerlani, A Bruderer, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 726-732, 2019 | 10 | 2019 |
| Glass panel packaging, as the most leading-edge packaging: Technologies and applications R Tummala, B Deprospo, S Dwarakanath, S Ravichandran, P Nimbalkar, ... 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2020 | 9 | 2020 |
| Substrate integrated waveguides in glass interposers for mm wave applications M ur Rehman, A Watanabe, S Ravichandran, M Swaminathan 2021 IEEE MTT-S International Microwave Symposium (IMS), 339-341, 2021 | 7 | 2021 |
| Next generation of automotive radar with leading-edge advances in SiGe devices and glass panel embedding (GPE) T Shi, Y Gong, S Ravichandran, V Sundaram, JD Cressler, R Tummala 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1245-1250, 2018 | 7 | 2018 |
| Packaging approaches for mm wave and sub-THz communication S Ravichandran, KQ Huang, M ur Rehman, S Erdogan, A Watanabe, ... 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019 | 5 | 2019 |
| First demonstration of ultra-thin glass panel embedded (gpe) package with sheet type epoxy molding compound for 5g/mm-wave applications N Ogura, S Ravichandran, T Shi, A Watanabe, S Yamada, ... International Symposium on Microelectronics 2019 (1), 000202-7, 2019 | 4 | 2019 |
Rao TummalaVerifierad e-postadress på ece.gatech.edu
