| Graphene related materials for thermal management Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ... 2D Materials 7 (1), 012001, 2020 | 190 | 2020 |
| Functionalization mediates heat transport in graphene nanoflakes H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ... Nature Communications 7 (1), 11281, 2016 | 162 | 2016 |
| Tailoring the thermal and mechanical properties of graphene film by structural engineering N Wang, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ... Small 14 (29), 1801346, 2018 | 159 | 2018 |
| Improved heat spreading performance of functionalized graphene in microelectronic device application Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ... Advanced Functional Materials 25 (28), 4430-4435, 2015 | 138 | 2015 |
| Cellulose-derived carbon nanofibers/graphene composite electrodes for powerful compact supercapacitors V Kuzmenko, N Wang, M Haque, O Naboka, M Flygare, K Svensson, ... RSC advances 7 (73), 45968-45977, 2017 | 89 | 2017 |
| Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures N Wang, S Pandit, L Ye, M Edwards, V Mokkapati, M Murugesan, ... Carbon 111, 402-410, 2017 | 59 | 2017 |
| Facile synthesis and characterization of ultrathin δ-MnO 2 nanoflakes X Chen, S Yan, N Wang, S Peng, C Wang, Q Hong, X Zhang, S Dai RSC advances 7 (88), 55734-55740, 2017 | 43 | 2017 |
| Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires N Wang, D Jiang, L Ye, M Murugesan, M Edwards, Y Fu, J Liu Advanced Functional Materials 25 (26), 4135-4143, 2015 | 22 | 2015 |
| High porosity and light weight graphene foam heat sink and phase change material container for thermal management A Zehri, MK Samani, MG Latorre, A Nylander, T Nilsson, Y Fu, N Wang, ... Nanotechnology 31 (42), 424003, 2020 | 20 | 2020 |
| Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors D Jiang, N Wang, M Edwards, W Mu, A Nylander, Y Fu, K Jeppson, J Liu Small 12 (11), 1521-1526, 2016 | 18 | 2016 |
| Improved interfacial bonding strength and reliability of functionalized graphene oxide for cement reinforcement applications N Wang, S Wang, L Tang, L Ye, B Cullbrand, A Zehri, BE Tebikachew, ... Chemistry–A European Journal 26 (29), 6561-6568, 2020 | 15 | 2020 |
| Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings Y Liu, C Xia, A Zehri, L Ye, N Wang, B Zhmud, H Lu, J Liu Coatings 9 (11), 754, 2019 | 15 | 2019 |
| Vertically aligned graphene-based thermal interface material with high thermal conductivity N Wang, S Chen, A Nkansah, Q Wang, X Wang, M Chen, L Ye, J Liu 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 15 | 2018 |
| A lightweight and high thermal performance graphene heat pipe Y Liu, S Chen, Y Fu, N Wang, D Mencarelli, L Pierantoni, H Lu, J Liu Nano Select 2 (2), 364-372, 2021 | 14 | 2021 |
| Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles Q Zhang, A Zehri, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, ... Soldering & Surface Mount Technology 31 (4), 193-202, 2019 | 14 | 2019 |
| Thermal characterization of power devices using graphene-based film P Zhang, N Wang, C Zandén, L Ye, Y Fu, J Liu 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 459-463, 2014 | 12 | 2014 |
| Graphene based thermal management system for battery cooling in electric vehicles Y Liu, T Thiringer, N Wang, Y Fu, H Lu, J Liu 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-4, 2020 | 11 | 2020 |
| Highly thermal conductive and light-weight graphene-based heatsink N Wang, Y Liu, L Ye, J Li 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 11 | 2019 |
| Development and characterization of graphene enhanced thermal conductive adhesives N Wang, N Logothetis, M Wei, S Huang, L Ye, J Liu 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016 | 11 | 2016 |
| Manufacturing Graphene‐Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor S Chen, A Zehri, Q Wang, G Yuan, X Liu, N Wang, J Liu ChemistryOpen 8 (1), 58-63, 2019 | 9 | 2019 |
Johan LiuProfessor, Chalmers University of TechnologyVerified email at chalmers.se
