| Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt Acta materialia 54 (11), 2907-2922, 2006 | 226 | 2006 |
| Influence of adsorbate ordering on rates of UV photooxidation of self-assembled monolayers DA Hutt, GJ Leggett The Journal of Physical Chemistry 100 (16), 6657-6662, 1996 | 210 | 1996 |
| Structure and mechanism of photooxidation of self-assembled monolayers of alkylthiols on silver studied by XPS and static SIMS DA Hutt, E Cooper, GJ Leggett The Journal of Physical Chemistry B 102 (1), 174-184, 1998 | 151 | 1998 |
| Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol DA Hutt, C Liu Applied surface science 252 (2), 400-411, 2005 | 137 | 2005 |
| Functionalization of hydroxyl and carboxylic acid terminated self-assembled monolayers DA Hutt, GJ Leggett Langmuir 13 (10), 2740-2748, 1997 | 112 | 1997 |
| Rates of attachment of fibroblasts to self-assembled monolayers formed by the adsorption of alkylthiols onto gold surfaces DA Hutt, TL Parker Journal of Materials Chemistry 7 (3), 435-441, 1997 | 85 | 1997 |
| Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002 | 70 | 2002 |
| Application of adhesives in MEMS and MOEMS assembly: a review F Sarvar, DA Hutt, DC Whalley 2nd International IEEE Conference on Polymers and Adhesives in …, 2002 | 68 | 2002 |
| Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt Acta materialia 55 (2), 737-752, 2007 | 67 | 2007 |
| Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate X Cui, DA Hutt, PP Conway Thin Solid Films 520 (19), 6095-6099, 2012 | 62 | 2012 |
| Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation JE Graves, M Sugden, RE Litchfield, DA Hutt, TJ Mason, AJ Cobley Ultrasonics sonochemistry 29, 428-438, 2016 | 44 | 2016 |
| The Evolution of Pd∕ Sn Catalytic Surfaces in Electroless Copper Deposition X Cui, DA Hutt, DJ Scurr, PP Conway Journal of the Electrochemical Society 158 (3), D172-D177, 2011 | 44 | 2011 |
| Electrodeposition of indium for bump bonding Y Tian, C Liu, D Hutt, B Stevens 2008 58th Electronic Components and Technology Conference, 2096-2100, 2008 | 38 | 2008 |
| Fluxless soldering of copper substrates using self-assembled monolayers for preservation C Liu, DA Hutt IEEE transactions on components and packaging technologies 29 (3), 512-521, 2006 | 38 | 2006 |
| Static secondary ion mass spectrometry studies of self-assembled monolayers: electron beam degradation of alkanethiols on gold DA Hutt, GJ Leggett Journal of materials chemistry 9 (4), 923-928, 1999 | 37 | 1999 |
| Megasonic agitation for enhanced electrodeposition of copper JG Kaufmann, MPY Desmulliez, Y Tian, D Price, M Hughes, N Strusevich, ... Microsystem technologies 15 (8), 1245-1254, 2009 | 36 | 2009 |
| Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures S Hou, S Qi, DA Hutt, JR Tyrer, M Mu, Z Zhou Journal of Materials Processing Technology 254, 310-324, 2018 | 33 | 2018 |
| Desorption of butanethiol from Au (111) during storage in ultrahigh vacuum: Effects on surface coverage and stability toward displacement by solution-phase thiols DA Hutt, GJ Leggett Langmuir 13 (11), 3055-3058, 1997 | 33 | 1997 |
| Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002 | 31 | 2002 |
| Fabrication of polymer waveguides by laser ablation using a 355 nm wavelength Nd: YAG laser SS Zakariyah, PP Conway, DA Hutt, DR Selviah, K Wang, J Rygate, ... Journal of Lightwave Technology 29 (23), 3566-3576, 2011 | 30 | 2011 |
