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- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Guoqiang YuInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
- Yabin FanWestern Digital/MIT/UCLAVerified email at wdc.com
- Juan G AlzateApple/Intel/UCLA/UniAndesVerified email at apple.com
- MURONG LANGUCLAVerified email at g.ucla.edu
- Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Xufeng KouShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Jianshi TangTsinghua University / IBM Research / UCLAVerified email at tsinghua.edu.cn
- Li-Te ChangElectrical Engineering, UCLAVerified email at g.ucla.edu
- Pedram KhaliliProfessor, Northwestern UniversityVerified email at northwestern.edu
- Ilya KrivorotovProfessor, University of California at IrvineVerified email at uci.edu
- Max MontazeriMetaVerified email at fb.com
- Mustafa AKYOLMaterials Science and Engineering, ATU Science and Technology UniversityVerified email at atu.edu.tr
- Jordan KatineSenior Director, Western Digital Research DivisionVerified email at wdc.com
- Liang HeProfessor, Nanjing University, ChinaVerified email at nju.edu.cn
- M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
- Qiming ShaoHKUST / UCLA / Tsinghua UniversityVerified email at ust.hk
- Sergiy CherepovHGST a Western Digital company, San Jose, CAVerified email at hgst.com
- So TakeiQueens College of the City University of New YorkVerified email at qc.cuny.edu
- Mehmet Cengiz OnbasliMassachusetts Institute of TechnologyVerified email at mit.edu