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Co-authors
- Dheeraj MohataSenior Integration Engineer, GCS IncVerified email at gcsincorp.com
- Huichu LiuIntel Labs, Intel CorporationVerified email at intel.com
- Theresa MayerPurdue UniversityVerified email at purdue.edu
- David GundlachNational Institute of Standards and TechnologyVerified email at nist.gov
- Prof. Mantu HudaitAssoc. Prof. of ECE, Virginia Tech; Past: Intel Corporation, Ohio State U, IISc-Bangalore, IIT-KGPVerified email at vt.edu
- Himanshu MadanIntel, PennState UniversityVerified email at intel.com
- Roman Engel-HerbertDirektor, Paul-Drude-Institut für Festkörperelektronik, Leibniz Institut im Foschungsverbund BerlinVerified email at pdi-berlin.de
- Yan ZhuToshiba America Electronic ComponentsVerified email at vt.edu
- Matthew J. HollanderPennsylvania State UniversityVerified email at psu.edu
- Gerhard KlimeckProfessor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Ashkar AliIntel CorporationVerified email at psu.edu
- Abhijeet paulGraduate Student Purdue University, Device Engineer GlobalfoundriesVerified email at globalfoundries.com
- Dmitry ZhernokletovIntermolecular Inc.Verified email at intermolecular.com
- Souvik MahapatraProfessor, EE Dept, IIT Bombay (Fellow of IEEE, INSA, IASc, INAE)Verified email at ee.iitb.ac.in
- Barry BrennanAtlantic Technological UniversityVerified email at atu.ie
- Robert M. WallaceUniversity of Texas at DallasVerified email at utdallas.edu
- Mehmet Onur BaykanAugmented Reality Hardware Reliability Engineer, FacebookVerified email at fb.com
- Wei LiHuman-machine Interaction Lab - CanadaVerified email at huawei.com