Thomas P. Moffat
Thomas P. Moffat
Verified email at nist.gov
Title
Cited by
Cited by
Year
Superconformal electrodeposition of copper in 500–90 nm features
TP Moffat, JE Bonevich, WH Huber, A Stanishevsky, DR Kelly, GR Stafford, ...
Journal of The Electrochemical Society 147 (12), 4524, 2000
5322000
Superconformal film growth: Mechanism and quantification
TP Moffat, D Wheeler, MD Edelstein, D Josell
IBM Journal of Research and Development 49 (1), 19-36, 2005
4072005
Superconformal electrodeposition of copper
TP Moffat, D Wheeler, WH Huber, D Josell
Electrochemical and Solid State Letters 4 (4), C26, 2001
3892001
Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS
TP Moffat, D Wheeler, D Josell
Journal of The Electrochemical Society 151 (4), C262, 2004
3402004
H2 evolution at Si-based metal–insulator–semiconductor photoelectrodes enhanced by inversion channel charge collection and H spillover
DV Esposito, I Levin, TP Moffat, AA Talin
Nature Materials 12 (6), 562-568, 2013
2332013
Superconformal electrodeposition in submicron features
D Josell, D Wheeler, WH Huber, TP Moffat
Physical Review Letters 87 (1), 016102, 2001
2142001
Self-terminating growth of platinum films by electrochemical deposition
Y Liu, D Gokcen, U Bertocci, TP Moffat
Science 338 (6112), 1327-1330, 2012
1862012
An electrochemical and X‐Ray photoelectron spectroscopy study of the passive state of chromium
TP Moffat, RM Latanision
Journal of the Electrochemical Society 139 (7), 1869, 1992
1771992
Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers
D Josell, D Wheeler, C Witt, TP Moffat
Electrochemical and Solid State Letters 6 (10), C143, 2003
1742003
A simple equation for predicting superconformal electrodeposition in submicrometer trenches
D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat
Journal of the Electrochemical Society 148 (12), C767, 2001
1712001
Extreme bottom-up superfilling of through-silicon-vias by damascene processing: suppressor disruption, positive feedback and turing patterns
TP Moffat, D Josell
Journal of The Electrochemical Society 159 (4), D208, 2012
1672012
Electrodeposition of Cu on Ru barrier layers for damascene processing
TP Moffat, M Walker, PJ Chen, JE Bonevich, WF Egelhoff, L Richter, C Witt, ...
Journal of the Electrochemical Society 153 (1), C37, 2005
1472005
Modeling superconformal electrodeposition using the level set method
D Wheeler, D Josell, TP Moffat
Journal of The Electrochemical Society 150 (5), C302, 2003
1432003
Curvature enhanced adsorbate coverage model for electrodeposition
TP Moffat, D Wheeler, SK Kim, D Josell
Journal of the Electrochemical Society 153 (2), C127, 2006
1402006
Electrochemical and scanning tunneling microscopic study of dealloying of Cu3Au
TP Moffat, FRF Fan, AJ Bard
Journal of the Electrochemical Society 138 (11), 3224, 1991
1401991
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
TP Moffat, D Wheeler, SK Kim, D Josell
Electrochimica Acta 53 (1), 145-154, 2007
1282007
Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system: reduction of overfill bump formation during superfilling
SK Kim, D Josell, TP Moffat
Journal of The Electrochemical Society 153 (9), C616, 2006
1272006
Artifacts in ballistic magnetoresistance measurements
WF Egelhoff Jr, L Gan, H Ettedgui, Y Kadmon, CJ Powell, PJ Chen, ...
Journal of applied physics 95 (11), 7554-7559, 2004
1042004
Electrodeposition of Ni1− x Al x in a Chloroaluminate Melt
TP Moffat
Journal of the Electrochemical Society 141 (11), 3059, 1994
981994
Cationic surfactants for the control of overfill bumps in Cu superfilling
SK Kim, D Josell, TP Moffat
Journal of The Electrochemical Society 153 (12), C826, 2006
952006
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Articles 1–20