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Sujith Subramanian
Sujith Subramanian
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First monolithic integration of 3d complementary fet (cfet) on 300mm wafers
S Subramanian, M Hosseini, T Chiarella, S Sarkar, P Schuddinck, ...
2020 Ieee Symposium on Vlsi Technology, 1-2, 2020
632020
Forksheet FETs for advanced CMOS scaling: forksheet-nanosheet co-integration and dual work function metal gates at 17nm NP space
H Mertens, R Ritzenthaler, Y Oniki, B Briggs, BT Chan, A Hikavyy, T Hopf, ...
2021 Symposium on VLSI Technology, 1-2, 2021
482021
Buried power rail integration with FinFETs for ultimate CMOS scaling
A Gupta, OV Pedreira, G Arutchelvan, H Zahedmanesh, K Devriendt, ...
IEEE Transactions on Electron Devices 67 (12), 5349-5354, 2020
322020
First monolithic integration of Ge P-FETs and InAs N-FETs on silicon substrate: Sub-120 nm III-V buffer, sub-5 nm ultra-thin body, common raised S/D, and gate stack modules
S Yadav, KH Tan, KH Goh, S Subramanian, KL Low, N Chen, B Jia, ...
2015 IEEE International Electron Devices Meeting (IEDM), 2.3. 1-2.3. 4, 2015
202015
Intel 4 CMOS technology featuring advanced FinFET transistors optimized for high density and high-performance computing
B Sell, S An, J Armstrong, D Bahr, B Bains, R Bambery, K Bang, D Basu, ...
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022
182022
Selective wet etching process for Ni-InGaAs contact formation in InGaAs N-MOSFETs with self-aligned source and drain
S Subramanian, Q Zhou, X Zhang, M Balakrishnan, YC Yeo
Journal of The Electrochemical Society 159 (1), H16, 2011
182011
Genetic algorithm for embedding a complete graph in a hypercube with a VLSI application
R Chandrasekharam, VV Vinod, S Subramanian
Microprocessing and microprogramming 40 (8), 537-552, 1994
181994
Buried power rail integration with Si FinFETs for CMOS scaling beyond the 5 nm node
A Gupta, H Mertens, Z Tao, S Demuynck, J Bömmels, G Arutchelvan, ...
2020 IEEE Symposium on VLSI Technology, 1-2, 2020
162020
N-channel InGaAs field-effect transistors formed on germanium-on-insulator substrates
I Subramanian, MHS Owen, KH Tan, WK Loke, S Wicaksono, SF Yoon, ...
Applied Physics Express 5 (11), 116502, 2012
122012
Genetic algorithm for test scheduling with different objectives
R Chandrasekharam, VV Vinod, S Subramanian
Integration 17 (2), 153-161, 1994
121994
Infrared spectroscopic ellipsometry study of sulfur-doped In0. 53Ga0. 47As ultra-shallow junctions
V Richard D'Costa, S Subramanian, D Li, S Wicaksono, S Fatt Yoon, ...
Applied Physics Letters 104 (23), 2014
82014
CoInGaAs as a novel self-aligned metallic source/drain material for implant-less In0. 53Ga0. 47As n-MOSFETs
EYJ Kong, S Subramanian, Q Zhou, J Pan, YC Yeo
Solid-state electronics 78, 62-67, 2012
72012
Embedded Metal Source/Drain (eMSD) for series resistance reduction in In0.53Ga0.47As n-channel Ultra-Thin Body Field-Effect Transistor (UTB-FET)
S Subramanian, YC Yeo
Proceedings of Technical Program of 2012 VLSI Technology, System and …, 2012
72012
Ultra-thin-body In0.7Ga0.3As-on-nothing N-MOSFET with Pd-InGaAs source/drain contacts enabled by a new self-aligned cavity formation technology
X Gong, Z Zhu, E Kong, R Cheng, S Subramanian, KH Goh, YC Yeo
Proceedings of Technical Program of 2012 VLSI Technology, System and …, 2012
72012
Engineering high quality and conformal ultrathin SiNx films by PEALD for downscaled and advanced CMOS nodes
AP Peter, T Tomomi, E Taishi, S Eiichiro, A Sepulveda, T Blanquart, ...
Journal of Vacuum Science & Technology A 39 (4), 2021
62021
P2S5/(NH4)2Sx-Based Sulfur Monolayer Doping for Source/Drain Extensions in n-Channel InGaAs FETs
S Subramanian, EYJ Kong, D Li, S Wicaksono, SF Yoon, YC Yeo
IEEE Transactions on Electron Devices 61 (8), 2767-2773, 2014
62014
FinFETs with thermally stable RMG gate stack for future DRAM peripheral circuits
E Capogreco, H Arimura, R Ritzenthaler, S Brus, Y Oniki, E Dupuy, ...
2022 International Electron Devices Meeting (IEDM), 26.2. 1-26.2. 4, 2022
42022
A control constrained test scheduling approach for VLSI circuits
S Misra, S Subramanian, PP Chaudhuri
Proceedings First Asian Test Symposium, 145,146,147,148,149,150-145,146,147 …, 1992
41992
Buried power rail integration for CMOS scaling beyond the 3 nm node
A Gupta, Z Tao, D Radisic, H Mertens, OV Pedreira, S Demuynck, ...
Advanced Etch Technology and Process Integration for Nanopatterning XI 12056 …, 2022
32022
Plasma doping of InGaAs at elevated substrate temperature for reduced sheet resistance and defect formation
EYJ Kong, S Subramanian, VR D’Costa, LH Chua, W Zou, C Chan, ...
IEEE Transactions on Electron Devices 61 (9), 3159-3165, 2014
32014
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