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Heterogeneous 2.5 D integration on through silicon interposer
X Zhang, JK Lin, S Wickramanayaka, S Zhang, R Weerasekera, R Dutta, ...
Applied physics reviews 2 (2), 021308, 2015
An analytical capacitance model for through-silicon vias in floating silicon substrate
R Weerasekera, G Katti, R Dutta, S Zhang, KF Chang, J Zhou, ...
IEEE Transactions on Electron Devices 63 (3), 1182-1188, 2016
Fabrication and assembly of Cu-RDL-based 2.5-D low-cost through silicon interposer (LC–TSI)
G Katti, SW Ho, LH Yu, S Zhang, R Dutta, R Weerasekera, KF Chang, ...
IEEE Design & Test 32 (4), 23-31, 2015
High bandwidth interconnect design opportunities in 2.5 D Through-silicon interposer (TSI)
R Weerasekera, KF Chang, S Zhang, G Katti, HY Li, R Dutta, JR Cubillo
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 241-244, 2016
Blockchain vs GDPR in collaborative data governance
R Dutta, A Das, A Dey, S Bhattacharya
International conference on cooperative design, visualization and …, 2020
An automatic chip-package co-design flow for multi-core neuromorphic computing SiPs
J Lan, VP Nambiar, R Sabapathy, R Dutta, CT Chong, MD Rotaru, KK Lin, ...
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 77-80, 2020
Material removal rate prediction using the classification-regression approach
KL Lim, R Dutta
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 172-175, 2020
Monolithic integration of high capacitance (power/ground) and low
G Katti, Y Weiliang, R Weerasekera, CK Fai, R Dutta, SW Ho, HY Li, ...
2015 IEEE International Conference on Electron Devices and Solid-State …, 2015
NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging
T Chou, W Tang, MD Rotaru, C Liu, R Dutta, SLP Siang, DHS Wee, ...
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022
Method and system for generating training data for a machine learning model for predicting performance in electronic design
R Dutta, R Salahuddin, KTC Chai
US Patent App. 17/296,657, 2022
Method and system for predicting performance in electronic design based on machine learning
R Salahuddin, R Dutta, KTC Chai, A James, CS Foo, Z Zeng, ...
US Patent App. 17/296,169, 2022
Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder
KL Lim, R Dutta
2021 IEEE International Conference on Prognostics and Health Management …, 2021
FireBird: A Fire Alert and Live Fire Monitoring System Based on Social Media Contribution
A Das, R Dutta, A Dey, T Tamisier, S Bhattacharya
International Conference on Cooperative Design, Visualization and …, 2020
Learning of Multi-Dimensional Analog Circuits Through Generative Adversarial Network (GAN)
R Dutta, S Raju, A James, CJ Leo, YJ Jeon, B Unnikrishnan, CS Foo, ...
2019 32nd IEEE International System-on-Chip Conference (SOCC), 394-399, 2019
Shellmark: A Robust Software Watermarking Tool
A Dey, R Dutta, S Bhattacharya, N Chaki
Proceedings of the ACM India Joint International Conference on Data Science …, 2019
Heterogeneous system implementation using through-silicon interposer (TSI) technology
R Weerasekera, Z Songbai, R Dutta, G Katti, KF Chang, J Zhou, JK Lin, ...
2015 IEEE International Conference on Electron Devices and Solid-State …, 2015
Branching waveguides with truncated structure and phase matching
S Ghosh, RK Dutta, AK Das, MK Pandit, HP Chan, KS Chiang
Journal of Optics 29 (3), 139-160, 2000
Ai-Jaial, NA, 339 Al-Omran, F., 339 Amat-Guerri, F., 87
E Amouyal, KN Babu, G Bartocci, B Baumbach, J Bendig, SW Bigger, ...
Litter, MI, 183 Liu, MTH, 133 Lukz%, J., 257
N Arsu, G Baldacchino, B Barni, Z Bastl, EE Batova, IR Bellobono, ...
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