| Heterogeneous 2.5 D integration on through silicon interposer X Zhang, JK Lin, S Wickramanayaka, S Zhang, R Weerasekera, R Dutta, ... Applied physics reviews 2 (2), 021308, 2015 | 109 | 2015 |
| An analytical capacitance model for through-silicon vias in floating silicon substrate R Weerasekera, G Katti, R Dutta, S Zhang, KF Chang, J Zhou, ... IEEE Transactions on Electron Devices 63 (3), 1182-1188, 2016 | 9 | 2016 |
| Fabrication and assembly of Cu-RDL-based 2.5-D low-cost through silicon interposer (LC–TSI) G Katti, SW Ho, LH Yu, S Zhang, R Dutta, R Weerasekera, KF Chang, ... IEEE Design & Test 32 (4), 23-31, 2015 | 9 | 2015 |
| High bandwidth interconnect design opportunities in 2.5 D Through-silicon interposer (TSI) R Weerasekera, KF Chang, S Zhang, G Katti, HY Li, R Dutta, JR Cubillo 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 241-244, 2016 | 7 | 2016 |
| Blockchain vs GDPR in collaborative data governance R Dutta, A Das, A Dey, S Bhattacharya International conference on cooperative design, visualization and …, 2020 | 6 | 2020 |
| An automatic chip-package co-design flow for multi-core neuromorphic computing SiPs J Lan, VP Nambiar, R Sabapathy, R Dutta, CT Chong, MD Rotaru, KK Lin, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 77-80, 2020 | 2 | 2020 |
| Material removal rate prediction using the classification-regression approach KL Lim, R Dutta 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 172-175, 2020 | 2 | 2020 |
| Monolithic integration of high capacitance (power/ground) and low G Katti, Y Weiliang, R Weerasekera, CK Fai, R Dutta, SW Ho, HY Li, ... 2015 IEEE International Conference on Electron Devices and Solid-State …, 2015 | 1 | 2015 |
| NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging T Chou, W Tang, MD Rotaru, C Liu, R Dutta, SLP Siang, DHS Wee, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | | 2022 |
| Method and system for generating training data for a machine learning model for predicting performance in electronic design R Dutta, R Salahuddin, KTC Chai US Patent App. 17/296,657, 2022 | | 2022 |
| Method and system for predicting performance in electronic design based on machine learning R Salahuddin, R Dutta, KTC Chai, A James, CS Foo, Z Zeng, ... US Patent App. 17/296,169, 2022 | | 2022 |
| Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder KL Lim, R Dutta 2021 IEEE International Conference on Prognostics and Health Management …, 2021 | | 2021 |
| FireBird: A Fire Alert and Live Fire Monitoring System Based on Social Media Contribution A Das, R Dutta, A Dey, T Tamisier, S Bhattacharya International Conference on Cooperative Design, Visualization and …, 2020 | | 2020 |
| Learning of Multi-Dimensional Analog Circuits Through Generative Adversarial Network (GAN) R Dutta, S Raju, A James, CJ Leo, YJ Jeon, B Unnikrishnan, CS Foo, ... 2019 32nd IEEE International System-on-Chip Conference (SOCC), 394-399, 2019 | | 2019 |
| Shellmark: A Robust Software Watermarking Tool A Dey, R Dutta, S Bhattacharya, N Chaki Proceedings of the ACM India Joint International Conference on Data Science …, 2019 | | 2019 |
| Heterogeneous system implementation using through-silicon interposer (TSI) technology R Weerasekera, Z Songbai, R Dutta, G Katti, KF Chang, J Zhou, JK Lin, ... 2015 IEEE International Conference on Electron Devices and Solid-State …, 2015 | | 2015 |
| Branching waveguides with truncated structure and phase matching S Ghosh, RK Dutta, AK Das, MK Pandit, HP Chan, KS Chiang Journal of Optics 29 (3), 139-160, 2000 | | 2000 |
| Ai-Jaial, NA, 339 Al-Omran, F., 339 Amat-Guerri, F., 87 E Amouyal, KN Babu, G Bartocci, B Baumbach, J Bendig, SW Bigger, ... | | |
| Litter, MI, 183 Liu, MTH, 133 Lukz%, J., 257 N Arsu, G Baldacchino, B Barni, Z Bastl, EE Batova, IR Bellobono, ... | | |
