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Mark E. Steinke
Mark E. Steinke
Advanced Micro Devices - DCGAP Thermal Mechanical Engineering, Sr. Manager
Verified email at amd.com
Title
Cited by
Cited by
Year
Single-phase liquid friction factors in microchannels
ME Steinke, SG Kandlikar
International journal of thermal sciences 45 (11), 1073-1083, 2006
5772006
An experimental investigation of flow boiling characteristics of water in parallel microchannels
ME Steinke, SG Kandlikar
J. Heat Transfer 126 (4), 518-526, 2004
3892004
Contact angles and interface behavior during rapid evaporation of liquid on a heated surface
SG Kandlikar, ME Steinke
International Journal of Heat and Mass Transfer 45 (18), 3771-3780, 2002
2372002
Single-phase heat transfer enhancement techniques in microchannel and minichannel flows
ME Steinke, SG Kandlikar
International Conference on Nanochannels, Microchannels, and Minichannels …, 2004
2342004
Apparatus and method for facilitating cooling of an electronics system
MK Iyengar, V Kamath, JA Matteson, RR Schmidt, ME Steinke
US Patent 7,660,109, 2010
1822010
Review of single-phase heat transfer enhancement techniques for application in microchannels, minichannels and microdevices
ME Steinke, SG Kandlikar
International Journal of Heat and Technology 22 (2), 3-11, 2004
1532004
Control and effect of dissolved air in water during flow boiling in microchannels
ME Steinke, SG Kandlikar
International Journal of Heat and Mass Transfer 47 (8-9), 1925-1935, 2004
1492004
High speed photographic observation of flow boiling of water in parallel minichannels
SG Kandlikar, ME Steinke, S Tian, LA Campbell
35th Proceedings of National Heat Transfer Conference, 1-10, 2001
1472001
Single-phase liquid heat transfer in plain and enhanced microchannels
ME Steinke, SG Kandlikar
International Conference on Nanochannels, Microchannels, and Minichannels …, 2006
1332006
Predicting heat transfer during flow boiling in minichannels and microchannels/Discussion
SG Kandlikar, ME Steinke
ASHRAE Transactions 109, 667, 2003
1332003
Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger
EA Eckberg, V Kamath, HV Mahaney Jr, WM Megarity, ME Steinke
US Patent 8,789,384, 2014
842014
Flow boiling and pressure drop in parallel flow microchannels
ME Steinke, SG Kandlikar
International Conference on Nanochannels, Microchannels, and Minichannels …, 2003
812003
Contact angles of droplets during spread and recoil after impinging on a heated surface
SG Kandlikar, ME Steinke
Chemical Engineering Research and Design 79 (4), 491-498, 2001
672001
Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
TJ Chainer, MA Gaynes, DP Graybill, MK Iyengar, V Kamath, ...
US Patent 8,493,738, 2013
652013
Liquid-cooled memory system having one cooling pipe per pair of DIMMs
GI Meijer, DI Schmidt, ME Steinke, JS Womble
US Patent 8,659,897, 2014
642014
Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
TJ Chainer, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ...
US Patent 9,027,360, 2015
612015
Thermal transfer structures coupling electronics card (s) to coolant-cooled structure (s)
MP David, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ...
US Patent 8,913,384, 2014
562014
Single-phase liquid heat transfer in microchannels
ME Steinke, SG Kandlikar
International Conference on Nanochannels, Microchannels, and Minichannels …, 2005
512005
Development of an experimental facility for investigating single-phase liquid flow in microchannels
ME Steinke, SG Kandlikar, JH Magerlein, EG Colgan, AD Raisanen
Heat transfer engineering 27 (4), 41-52, 2006
492006
Liquid-cooling memory modules with liquid flow pipes between memory module sockets
RM Barina, V Kamath, C Ni, DI Schmidt, ME Steinke, JS Womble
US Patent 8,587,943, 2013
482013
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