Jie LIANG
Title
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Year
A survey of carbon nanotube interconnects for energy efficient integrated circuits
A Todri-Sanial, R Ramos, H Okuno, J Dijon, A Dhavamani, M Widlicenus, ...
IEEE Circuits and Systems Magazine 17 (2), 47-62, 2017
202017
A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects
J Liang, R Ramos, J Dijon, H Okuno, D Kalita, D Renaud, J Lee, ...
2017 IEEE International Electron Devices Meeting (IEDM), 35.5. 1-35.5. 4, 2017
92017
Physical description and analysis of doped carbon nanotube interconnects
J Liang, L Zhang, N Azemard-Crestani, P Nouet, A Todri-Sanial
2016 26th International Workshop on Power and Timing Modeling, Optimization …, 2016
82016
Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect Applications
J Liang, R Chen, R Ramos, J Lee, H Okuno, D Kalita, V Georgiev, ...
IEEE Transactions on Electron Devices, 2019
62019
Understanding electromigration in Cu-CNT composite interconnects: A multiscale electrothermal simulation study
J Lee, S Berrada, F Adamu-Lema, N Nagy, VP Georgiev, T Sadi, J Liang, ...
IEEE Transactions on Electron Devices 65 (9), 3884-3892, 2018
52018
Progress on carbon nanotube BEOL interconnects
B Uhlig, J Liang, J Lee, R Ramos, A Dhavamani, N Nagy, J Dijon, ...
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 937-942, 2018
52018
The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations
J Lee, S Berrada, J Liang, T Sadi, VP Georgiev, A Todri-Sanial, D Kalita, ...
2017 International Conference on Simulation of Semiconductor Processes and …, 2017
52017
Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances—Part I: Pristine MWCNT
DK Chen, Rongmei, Jie Liang, Jaehyun Lee, Vihar P. Georgiev, Raphael Ramos ...
IEEE Transactions on Electron Devices 99, 1-8, 2018
4*2018
Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances--Part II: Impact of Charge Transfer Doping
R Chen, J Liang, J Lee, VP Georgiev, R Ramos, H Okuno, D Kalita, ...
IEEE Transactions on Electron Devices, 1-8, 2018
32018
Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
B Uhlig, A Dhavamani, N Nagy, K Lilienthal, R Liske, R Ramos, J Dijon, ...
2018 IEEE International Interconnect Technology Conference (IITC), 16-18, 2018
32018
Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology
J Lee, J Liang, SM Amoroso, T Sadi, L Wang, F Asenov, A Pender, ...
2017 International Conference on Simulation of Semiconductor Processes and …, 2017
32017
Atomistic-to Circuit-Level Modeling of Doped SWCNT for On-Chip Interconnects
J Liang, J Lee, S Berrada, VP Georgiev, R Pandey, R Chen, A Asenov, ...
IEEE Transactions on Nanotechnology 17 (6), 1084-1088, 2018
22018
Importance of Interconnects: A Technology-System-Level Design Perspective
J Liang, A Todri-Sanial
65th International Electron Device Meeting (IEDM), 2019
12019
Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect Application
J Liang
1
Piezoelectric Sensors Based on 1D/2D Materials for Smart Health Monitorin IoT
M Dhifallah, J Liang, T Gil, N Azemard, B Charlot, A Giani, A Lacampagne, ...
2019
Understanding Electromigration in Cu-CNT Composite Interconnects
J Lee, S Berrada, F Adamu-Lema, N Nagy, VP Georgiev, T Sadi, J Liang, ...
2018
Atomistic to circuit level modeling of defective doped SWCNTs with contacts for on-chip interconnect application
J Liang, J Lee, S Berrada, V Georgiev, A Asenov, N Azemard-Crestani, ...
2017 IEEE 12th Nanotechnology Materials and Devices Conference (NMDC), 66-67, 2017
2017
Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect Application
A Todri-Sanial, J Liang
GRAPHENE, 2017
2017
SPECIAL SECTION ON NMDC2017
J Liang, J Lee, S Berrada, VP Georgiev, R Pandey, R Chen, A Asenov, ...
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