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Niru Kumari
Niru Kumari
Hewlett Packard Labs
Verified email at hpe.com
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Cited by
Cited by
Year
Physical Characterization of Current-and Temperature-Controlled Negative Differential Resistances in NbO2
S Kumar, Z Wang, N Kumari, N Davila, X Huang, JP Strachan, ...
APS March Meeting Abstracts, 2017
178*2017
Physical origins of current and temperature controlled negative differential resistances in NbO2
S Kumar, Z Wang, N Davila, N Kumari, K Norris, X Huang, JP Strachan, ...
Nature Communications, 2017
1782017
Conduction Channel Formation and Dissolution Due to Oxygen Thermophoresis/Diffusion in Hafnium Oxide Memristors
S Kumar, Z Wang, X Huang, N Kumari, N Davila, JP Strachan, D Vine, ...
ACS nano 10 (12), 11205-11210, 2016
1122016
Towards the design and operation of net-zero energy data centers
M Arlitt, C Bash, S Blagodurov, Y Chen, T Christian, D Gmach, C Hyser, ...
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 …, 2012
942012
Analysis of evaporating mist flow for enhanced convective heat transfer
N Kumari, V Bahadur, M Hodes, T Salamon, P Kolodner, A Lyons, ...
International Journal of Heat and Mass Transfer 53 (15), 3346-3356, 2010
912010
Characterization of the heat transfer accompanying electrowetting or gravity-induced droplet motion
N Kumari, SV Garimella
International Journal of Heat and Mass Transfer 54 (17), 4037-4050, 2011
762011
Oxygen migration during resistance switching and failure of hafnium oxide memristors
S Kumar, Z Wang, X Huang, N Kumari, N Davila, JP Strachan, D Vine, ...
Applied Physics Letters 110 (10), 2017
752017
Electrical actuation of electrically conducting and insulating droplets using ac and dc voltages
N Kumari, V Bahadur, SV Garimella
Journal of Micromechanics and Microengineering 18 (10), 105015, 2008
652008
A holistic and optimal approach for data center cooling management
R Zhou, Z Wang, CE Bash, A McReynolds, C Hoover, R Shih, N Kumari, ...
Proceedings of the 2011 American Control Conference, 1346-1351, 2011
642011
Electrical actuation of dielectric droplets
N Kumari, V Bahadur, SV Garimella
Journal of micromechanics and microengineering 18 (8), 085018, 2008
602008
Electrowetting-induced dewetting transitions on superhydrophobic surfaces
N Kumari, SV Garimella
Langmuir 27 (17), 10342-10346, 2011
512011
Characterization of ultrahydrophobic hierarchical surfaces fabricated using a single-step fabrication methodology
S Dash, N Kumari, SV Garimella
Journal of Micromechanics and Microengineering 21 (10), 105012, 2011
432011
Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction
SW Fong, A Sood, L Chen, N Kumari, M Asheghi, KE Goodson, ...
Journal of Applied Physics 120 (1), 015103, 2016
422016
Frequency-dependent transient response of an oscillating electrically actuated droplet
S Dash, N Kumari, SV Garimella
Journal of Micromechanics and Microengineering 22 (7), 075004, 2012
332012
Controlled flow of a thin liquid film by electrowetting
SV Garimella, HK Dhavaleswarapu, N Kumari
US Patent 8,632,670, 2014
302014
From chip to cooling tower data center modeling: Influence of air-stream containment on operating efficiency
TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, B Rubenstein, S Heath, ...
Journal of Electronic Packaging 134 (4), 041006, 2012
232012
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, N Kumari, T Cader
Journal of Electronic Packaging 134 (4), 041009, 2012
222012
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, N Kumari, T Cader
Journal of Electronic Packaging 134 (4), 041009, 2012
222012
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash, B Rubenstein, S Heath, ...
Journal of Electronic Packaging 134 (4), 041006, 2012
222012
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
EJ Walsh, J Punch, AJ Shah, CE Bash, N Kumari, T Cader
22*
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