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Farzad Houshmand
Farzad Houshmand
Postdoctoral Scholar, Stanford University
Verified email at stanford.edu
Title
Cited by
Cited by
Year
Superhydrophobic graphene foams
E Singh, Z Chen, F Houshmand, W Ren, Y Peles, HM Cheng, N Koratkar
small 9 (1), 75-80, 2013
2222013
Extreme two‐phase cooling from laser‐etched diamond and conformal, template‐fabricated microporous copper
JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ...
Advanced Functional Materials 27 (45), 1703265, 2017
982017
Convective heat transfer and mixing enhancement in a microchannel with a pillar
Y Wang, F Houshmand, D Elcock, Y Peles
International Journal of Heat and Mass Transfer 62, 553-561, 2013
862013
Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices
H Lee, DD Agonafer, Y Won, F Houshmand, C Gorle, M Asheghi, ...
Journal of Electronic Packaging 138 (1), 010907, 2016
762016
Graphene drape minimizes the pinning and hysteresis of water drops on nanotextured rough surfaces
E Singh, AV Thomas, R Mukherjee, X Mi, F Houshmand, Y Peles, Y Shi, ...
ACS nano 7 (4), 3512-3521, 2013
592013
Transient flow boiling heat-transfer measurements in microdomains
SR Rao, F Houshmand, Y Peles
International Journal of Heat and Mass Transfer 76, 317-329, 2014
492014
High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply
JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
402016
Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density Gan-Sic chip
T Liu, F Houshmand, C Gorle, S Scholl, H Lee, Y Won, M Asheghi, ...
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
312015
Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics
S Scholl, C Gorle, F Houshmand, T Liu, H Lee, Y Won, M Asheghi, ...
International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015
292015
Piranha Pin-Fins (PPF): Voracious boiling heat transfer by vapor venting from microchannels-system calibration and single-phase fluid dynamics
C Woodcock, F Houshmand, J Plawsky, M Izenson, D Fogg, R Hill, ...
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
282014
Heat transfer enhancement with liquid–gas flow in microchannels and the effect of thermal boundary layer
F Houshmand, Y Peles
International Journal of Heat and Mass Transfer 70, 725-733, 2014
272014
Validation study for VOF simulations of boiling in a microchannel
C Gorlé, H Lee, F Houshmand, M Asheghi, K Goodson, PR Parida
International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015
262015
Convective heat transfer to shear-driven liquid film flow in a microchannel
F Houshmand, Y Peles
International Journal of Heat and Mass Transfer 64, 42-52, 2013
242013
Optimization of a microchannel geometry for cooling high heat flux microelectronics using numerical methods
S Scholl, C Gorle, F Houshmand, T Verstraete, M Asheghi, K Goodson
InterPACK, San Francisco, CA, 2015
232015
Bubble formation from a micro-pillar in a microchannel
F Houshmand, D Elcock, M Amitay, Y Peles
International journal of multiphase flow 59, 44-53, 2014
182014
Active control of flow boiling oscillation amplitude and frequency using a transverse jet in crossflow
AK Vutha, SR Rao, F Houshmand, Y Peles
Applied Physics Letters 108 (13), 2016
162016
Impact of flow dynamics on the heat transfer of bubbly flow in a microchannel
F Houshmand, Y Peles
Journal of heat transfer 136 (2), 022902, 2014
152014
Volume-of-fluid simulation for predicting two-phase cooling in a microchannel
C Gorle, P Parida, F Houshmand, M Asheghi, K Goodson
APS Division of Fluid Dynamics Meeting Abstracts, G11. 010, 2014
122014
Lateral plasma/radical source
AK Subramani, K Gangakhedkar, A Chowdhury, JC Forster, ...
US Patent 10,121,655, 2018
112018
Symmetric plasma source to generate pie shaped treatment
AK Subramani, F Houshmand, PA Kraus, A Chowdhury, JC Forster, ...
US Patent 10,879,042, 2020
82020
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