Smart electric vehicle (ev) charging and grid integration apparatus and methods R Gadh, S Mal, S Prabhu, CC Chu, O Sheikh, CY Chung, L He, B Xiao, ... US Patent 9,026,347, 2015 | 678 | 2015 |
Scaling for edge inference of deep neural networks X Xu, Y Ding, SX Hu, M Niemier, J Cong, Y Hu, Y Shi Nature Electronics 1 (4), 216-222, 2018 | 260 | 2018 |
Accuracy vs. efficiency: Achieving both through fpga-implementation aware neural architecture search W Jiang, X Zhang, EHM Sha, L Yang, Q Zhuge, Y Shi, J Hu Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019 | 107 | 2019 |
Hardware/software co-exploration of neural architectures W Jiang, L Yang, EHM Sha, Q Zhuge, S Gu, S Dasgupta, Y Shi, J Hu IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2020 | 91 | 2020 |
Quantization of fully convolutional networks for accurate biomedical image segmentation X Xu, Q Lu, L Yang, S Hu, D Chen, Y Hu, Y Shi Proceedings of the IEEE conference on computer vision and pattern …, 2018 | 82 | 2018 |
Thermal-aware cell and through-silicon-via co-placement for 3D ICs J Cong, G Luo, Y Shi Proceedings of the 48th Design Automation Conference, 670-675, 2011 | 81 | 2011 |
Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power H Yu, Y Shi, L He, T Karnik IEEE transactions on very large scale integration (VLSI) systems 16 (12 …, 2008 | 74 | 2008 |
A universal state-of-charge algorithm for batteries B Xiao, Y Shi, L He Proceedings of the 47th Design Automation Conference, 687-692, 2010 | 71 | 2010 |
Co-exploration of neural architectures and heterogeneous asic accelerator designs targeting multiple tasks L Yang, Z Yan, M Li, H Kwon, L Lai, T Krishna, V Chandra, W Jiang, Y Shi 2020 57th ACM/IEEE Design Automation Conference (DAC), 1-6, 2020 | 70 | 2020 |
On the efficacy of through-silicon-via inductors UR Tida, R Yang, C Zhuo, Y Shi IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23 (7 …, 2014 | 61 | 2014 |
Achieving super-linear speedup across multi-fpga for real-time dnn inference W Jiang, EHM Sha, X Zhang, L Yang, Q Zhuge, Y Shi, J Hu ACM Transactions on Embedded Computing Systems (TECS) 18 (5s), 1-23, 2019 | 59 | 2019 |
On neural architecture search for resource-constrained hardware platforms Q Lu, W Jiang, X Xu, Y Shi, J Hu arXiv preprint arXiv:1911.00105, 2019 | 58 | 2019 |
Demand-side management of domestic electric water heaters using approximate dynamic programming K Al-Jabery, Z Xu, W Yu, DC Wunsch, J Xiong, Y Shi IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2016 | 56 | 2016 |
An analytical placement framework for 3-D ICs and its extension on thermal awareness G Luo, Y Shi, J Cong IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 54 | 2013 |
Measurement and evaluation of power analysis attacks on asynchronous S-box J Wu, Y Shi, M Choi IEEE Transactions on Instrumentation and Measurement 61 (10), 2765-2775, 2012 | 54 | 2012 |
Device-circuit-architecture co-exploration for computing-in-memory neural accelerators W Jiang, Q Lou, Z Yan, L Yang, J Hu, XS Hu, Y Shi IEEE Transactions on Computers 70 (4), 595-605, 2020 | 46 | 2020 |
Dac-sdc low power object detection challenge for uav applications X Xu, X Zhang, B Yu, XS Hu, C Rowen, J Hu, Y Shi IEEE transactions on pattern analysis and machine intelligence 43 (2), 392-403, 2019 | 46 | 2019 |
Novel through-silicon-via inductor-based on-chip DC-DC converter designs in 3D ICs UR Tida, C Zhuo, Y Shi ACM Journal on Emerging Technologies in Computing Systems (JETC) 11 (2), 1-14, 2014 | 44 | 2014 |
Variability-aware parametric yield estimation for analog/mixed-signal circuits: Concepts, algorithms, and challenges F Gong, Y Shi, H Yu, L He IEEE Design & Test 31 (4), 6-15, 2014 | 41 | 2014 |
Standing on the shoulders of giants: Hardware and neural architecture co-search with hot start W Jiang, L Yang, S Dasgupta, J Hu, Y Shi IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2020 | 40 | 2020 |