| Fast accurate full-chip dynamic thermal simulation with fine resolution enabled by a learning method L Jiang, Y Liu, MC Cheng IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2022 | 5 | 2022 |
| An effective and accurate data-driven approach for thermal simulation of CPUs L Jiang, Y Liu, MC Cheng 2021 20th IEEE intersociety conference on thermal and thermomechanical …, 2021 | 5 | 2021 |
| Optimal design of Co/In/Cu sputtering target assembly using finite element method and taguchi method L Jiang, L Zhang, ZQ Liu Acta Metallurgica Sinica (English Letters) 32, 1407-1414, 2019 | 5 | 2019 |
| An effective physics simulation methodology based on a data-driven learning algorithm L Jiang, M Veresko, Y Liu, MC Cheng Proceedings of the Platform for Advanced Scientific Computing Conference, 1-10, 2022 | 3 | 2022 |
| PODTherm-GP: A Physics-based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUs L Jiang, A Dowling, MC Cheng, Y Liu IEEE Transactions on Computers, 2023 | 2 | 2023 |
| Exploring an efficient approach for architecture-level thermal simulation of multi-core CPUs L Jiang, A Dowling, Y Liu, MC Cheng 2022 IEEE International Symposium on Circuits and Systems (ISCAS), 278-282, 2022 | 2 | 2022 |
| Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model A Dowling, L Jiang, MC Cheng, Y Liu arXiv preprint arXiv:2310.00854, 2023 | 1 | 2023 |
| Chip-level thermal simulation for a multicore processor using a multi-block model enabled by proper orthogonal decomposition L Jiang, A Dowling, Y Liu, MC Cheng 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Ensemble learning model for effective thermal simulation of multi-core CPUs L Jiang, A Dowling, Y Liu, MC Cheng Integration, 102201, 2024 | | 2024 |
| TDF: A compact file format plugin for FEniCS A Dowling, L Jiang, MC Cheng, Y Liu SoftwareX 22, 101329, 2023 | | 2023 |
| TDF: A file format for FEniCS A Dowling, L Jiang, MC Cheng, Y Liu SOFTWAREX 22, 2023 | | 2023 |
| Physics-driven proper orthogonal decomposition: A simulation methodology for partial differential equations A Pulimeno, G Coates-Farley, M Veresko, L Jiang, MC Cheng, Y Liu, ... MethodsX 10, 102204, 2023 | | 2023 |
| Effective physics simulations based on model reduction and domain decomposition L Jiang, Y Liu, MC Cheng PROCEEDINGS OF THE ELEVENTH INTERNATIONAL CONFERENCE ON ENGINEERING …, 2022 | | 2022 |
| Thermal Simulation of a CPU Based on Model Order Reduction K Ruttan, L Jiang, A Dowling, Y Liu, MC Cheng 2020 IEEE MIT Undergraduate Research Technology Conference (URTC), 1-4, 2020 | | 2020 |
| Effects of Al Interlayer and Ni (V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly L Jiang, L Zhang, Z Liu Acta Metall Sin 56 (10), 1433-1440, 2020 | | 2020 |
