A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
155 2020 First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018
64 2018 Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ...
IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020
46 2020 First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017
38 2017 Broadband and miniaturized antenna-in-package (AiP) design for 5G applications TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ...
IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020
37 2020 Miniaturized high-performance filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018
33 2018 Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020
32 2020 Characterization of ABF/glass/ABF substrates for mmWave applications M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
31 2021 Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions A Watanabe, TH Lin, PM Raj, V Sundaram, MM Tentzeris, RR Tummala, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2026-2031, 2018
29 2018 Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications TH Lin, PM Raj, A Watanabe, V Sundaram, R Tummala, MM Tentzeris
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 911-915, 2017
23 2017 Innovative Sub-5- F Liu, G Khurana, R Zhang, A Watanabe, BH DeProspo, C Nair, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019
22 2019 Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016
22 2016 Package-integrated, wideband power dividing networks and antenna arrays for 28-GHz 5G new radio bands M Ali, AO Watanabe, TH Lin, D Okamoto, MR Pulugurtha, MM Tentzeris, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
20 2020 Advanced low-loss and high-density photosensitive dielectric material for RF/millimeter-wave applications H Ito, K Kanno, A Watanabe, R Tsuyuki, R Tatara, M Raj, RR Tummala
2019 International Wafer Level Packaging Conference (IWLPC), 1-6, 2019
19 2019 Ultralow-loss substrate-integrated waveguides in glass-based substrates for millimeter-wave applications AO Watanabe, BK Tehrani, T Ogawa, PM Raj, MM Tentzeris, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
18 2020 Interfacial spin-glass-like state in A Truong, AO Watanabe, PA Mortemousque, K Ando, T Sato, T Taniyama, ...
Physical Review B 91 (21), 214425, 2015
17 2015 Advanced low loss dielectric material reliability and filter characteristics at high frequency for mmWave applications T Kakutani, D Okamoto, Z Guan, Y Suzuki, M Ali, A Watanabe, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 653-659, 2020
16 2020 Heterogeneous integration of 5G and millimeter-wave diplexers with 3D glass substrates M Ali, A Watanabe, T Kakutani, PM Raj, RR Tummala, M Swaminathan
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1376-1382, 2020
15 2020 Evidence of a perpendicular magnetocrystalline anisotropy in a A Truong, AO Watanabe, T Sekiguchi, PA Mortemousque, T Sato, K Ando, ...
Physical Review B 90 (22), 224415, 2014
14 2014 Sintered nanocopper paste for high-performance 3D heterogeneous package integration Y Wang, AO Watanabe, N Ogura, PM Raj, R Tummala
Journal of Electronic Materials 49, 6737-6745, 2020
13 2020 
Rao TummalaVerifierad e-postadress på ece.gatech.edu
