Through-silicon vias filled with densified and transferred carbon nanotube forests T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu IEEE Electron Device Letters 33 (3), 420-422, 2012 | 87 | 2012 |
Vertically stacked carbon nanotube-based interconnects for through silicon via application D Jiang, W Mu, S Chen, Y Fu, K Jeppson, J Liu IEEE Electron Device Letters 36 (5), 499-501, 2015 | 45 | 2015 |
mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application D Jiang, T Wang, S Chen, L Ye, J Liu Microelectronic Engineering 103, 177-180, 2013 | 43 | 2013 |
Carbon nanotubes for electronics manufacturing and packaging: From growth to integration J Liu, D Jiang, Y Fu, T Wang Advances in Manufacturing 1, 13-27, 2013 | 31 | 2013 |
Formation of three-dimensional carbon nanotube structures by controllable vapor densification T Wang, D Jiang, S Chen, K Jeppson, L Ye, J Liu Materials Letters 78, 184-187, 2012 | 31 | 2012 |
Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu Journal of Electronic Materials 44, 2898-2907, 2015 | 26 | 2015 |
High prevalence of overweight and obesity among inner city Chinese children in Shanghai, 2011 XX Jiang, LL Hardy, LA Baur, D Ding, L Wang, HJ Shi Annals of Human Biology 41 (5), 469-472, 2014 | 26 | 2014 |
Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires N Wang, D Jiang, L Ye, M Murugesan, M Edwards, Y Fu, J Liu Advanced Functional Materials 25 (26), 4135-4143, 2015 | 22 | 2015 |
Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors D Jiang, N Wang, M Edwards, W Mu, A Nylander, Y Fu, K Jeppson, J Liu Small 12 (11), 1521-1526, 2016 | 18 | 2016 |
Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats J Daon, S Sun, D Jiang, G Cibien, E Leveugle, C Galindo, A Ziaei, L Ye, ... 20th International Workshop on Thermal Investigations of ICs and Systems, 1-4, 2014 | 10 | 2014 |
Chemically enhanced carbon nanotubes based thermal interface materials J Daon, S Sun, D Jiang, E Leveugle, C Galindo, S Jus, A Ziaei, L Ye, Y Fu, ... 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 8 | 2015 |
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds D Jiang, S Sun, M Edwards, K Jeppson, N Wang, Y Fu, J Liu Flexible and Printed Electronics 2 (2), 025003, 2017 | 5 | 2017 |
Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material S Chen Soldering & Surface Mount Technology 25 (4), 242-250, 2013 | 5 | 2013 |
Carbon nanotubes in electronics interconnect applications with a focus on 3D-TSV technology D Jiang, T Wang, LL Ye, K Jeppson, J Liu ECS Transactions 44 (1), 683, 2012 | 4 | 2012 |
Carbon nanotube based interconnect material for electronic applications D Jiang PQDT-Global, 2015 | 3 | 2015 |
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD L Xu, D Jiang, YF Fu, S Xavier, S Bansropun, A Ziaei, ST Tu, J Liu Advances in Manufacturing 1, 236-240, 2013 | 3 | 2013 |
Test structures for studying flexible interconnect supported by carbon nanotube scaffolds D Jiang, S Sun, M Edwards, K Jeppson 2017 International Conference of Microelectronic Test Structures (ICMTS), 1-4, 2017 | 2 | 2017 |
Reliability of carbon nanotube bumps for chip on glass application X Fan, X Li, W Mu, D Jiang, S Huang, Y Fu, Y Zhang, J Liu Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 2 | 2014 |
Experimental and numerical investigations on the performance and reliability of CNT fins for micro-cooler Y Zhang, H Lv, J Fan, D Jiang, J Liu 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 2 | 2012 |
Sn–3.0Ag–0.5Cu Nanocomposite Solder Reinforced With Bi2Te3Nanoparticles S Chen, X Luo, D Jiang, L Ye, M Edwards, J Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (8 …, 2015 | 1 | 2015 |