| Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient N Zhao, Y Zhong, ML Huang, HT Ma, W Dong Scientific reports 5 (1), 13491, 2015 | 117 | 2015 |
| Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient N Zhao, Y Zhong, ML Huang, HT Ma, W Dong Intermetallics 79, 28-34, 2016 | 39 | 2016 |
| Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111) Cu interface under temperature gradient Y Zhong, N Zhao, CY Liu, W Dong, YY Qiao, YP Wang, HT Ma Applied Physics Letters 111 (22), 2017 | 35 | 2017 |
| Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect N Zhao, Y Zhong, W Dong, ML Huang, HT Ma, CP Wong Applied Physics Letters 110 (9), 2017 | 30 | 2017 |
| In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient N Zhao, Y Zhong, ML Huang, W Dong, HT Ma, YP Wang Journal of Alloys and Compounds 682, 1-6, 2016 | 26 | 2016 |
| Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition Y Zhong, N Zhao, HT Ma, W Dong, ML Huang Journal of Alloys and Compounds 695, 1436-1443, 2017 | 24 | 2017 |
| In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient Y Zhong, M Huang, H Ma, W Dong, Y Wang, N Zhao Journal of Materials Research 31 (5), 609-617, 2016 | 20 | 2016 |
| Abnormal intermetallic compound evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni micro solder joints under thermomigration N Zhao, JF Deng, Y Zhong, ML Huang, HT Ma Journal of Electronic Materials 46, 1931-1936, 2017 | 17 | 2017 |
| Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7 Cu solder N Zhao, ML Huang, Y Zhong, HT Ma, XM Pan Journal of Materials Science: Materials in Electronics 26, 345-352, 2015 | 15 | 2015 |
| Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding Y Zhong, N Zhao, W Dong, H Ma, M Huang, L Yin, C Wong Journal of Materials Research 32 (16), 3128-3136, 2017 | 10 | 2017 |
| In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient Y Zhong, N Zhao, W Dong, YP Wang, HT Ma Materials Chemistry and Physics 216, 130-135, 2018 | 6 | 2018 |
| Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects Y Zhong, N Zhao, W Dong, Y Wang, H Ma 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | 5 | 2018 |
| Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient N Zhao, J Deng, Y Zhong, H Ma, Y Wang, C Wong Journal of Materials Research 32 (18), 3555-3563, 2017 | 4 | 2017 |
| 微焊点中金属原子的热迁移及其对界面反应影响的研究进展 赵宁， 钟毅， 黄明亮， 马海涛 中国有色金属学报 25 (8), 2157-2166, 2015 | 4 | 2015 |
| Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient Y Zhong, N Zhao, HT Ma, W Dong, ML Huang, CP Wong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 411-416, 2017 | 3 | 2017 |
| Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints Z Ning, Z Yi, H Ming-Liang, M Hai-Tao, L Xiao-Ping Acta Physica Sinica 64 (16), 2015 | 3 | 2015 |
| Interfacial reactions in Cu/Sn/Cu (Ni) systems during soldering under temperature gradient N Zhao, Y Zhong, M Huang, H Ma 2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015 | 2 | 2015 |
| 热迁移对 Cu/Sn/Cu 焊点液-固界面 Cu_6Sn_5 生长动力学的影响 赵宁， 钟毅， 黄明亮， 马海涛， 刘小平 物理学报, 344-353, 2015 | 2 | 2015 |
| Formation of preferred orientation of Cu6Sn5grains in Cu/Sn/Cu interconnects by soldering under temperature gradient Y Zhong, N Zhao, W Dong, H Ma, Y Wang, CP Wong 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 1 | 2017 |
| Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration Y Zhong, M Huang, J Deng, H Ma, W Dong, N Zhao 2016 China Semiconductor Technology International Conference (CSTIC), 1-3, 2016 | 1 | 2016 |
