Wei Huang
Wei Huang
AMD Research, IBM Research, University of Virginia, University of Science and Technology of China
Verifierad e-postadress på amd.com - Startsida
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Temperature-aware microarchitecture
K Skadron, MR Stan, W Huang, S Velusamy, K Sankaranarayanan, ...
ACM SIGARCH Computer Architecture News 31 (2), 2-13, 2003
14952003
HotSpot: A compact thermal modeling methodology for early-stage VLSI design
W Huang, S Ghosh, S Velusamy, K Sankaranarayanan, K Skadron, ...
IEEE Transactions on very large scale integration (VLSI) systems 14 (5), 501-513, 2006
10442006
Temperature-aware microarchitecture: Modeling and implementation
K Skadron, MR Stan, K Sankaranarayanan, W Huang, S Velusamy, ...
ACM Transactions on Architecture and Code Optimization (TACO) 1 (1), 94-125, 2004
8552004
Compact thermal modeling for temperature-aware design
W Huang, MR Stan, K Skadron, K Sankaranarayanan, S Ghosh, ...
Proceedings of the 41st annual Design Automation Conference, 878-883, 2004
3982004
Temperature-aware computer systems: Opportunities and challenges
K Skadron, MR Stan, W Huang, S Velusamy, K Sankaranarayanan, ...
IEEE Micro 23 (6), 52-61, 2003
1442003
Many-core design from a thermal perspective
W Huang, MR Stan, K Sankaranarayanan, RJ Ribando, K Skadron
2008 45th ACM/IEEE Design Automation Conference, 746-749, 2008
1352008
Accurate, pre-RTL temperature-aware design using a parameterized, geometric thermal model
W Huang, K Sankaranarayanan, K Skadron, RJ Ribando, MR Stan
IEEE Transactions on Computers 57 (9), 1277-1288, 2008
1302008
Hotspot: A dynamic compact thermal model at the processor-architecture level
MR Stan, K Skadron, M Barcella, W Huang, K Sankaranarayanan, ...
Microelectronics Journal 34 (12), 1153-1165, 2003
1292003
Scaling with design constraints: Predicting the future of big chips
W Huang, K Rajamani, MR Stan, K Skadron
IEEE Micro 31 (4), 16-29, 2011
1282011
Monitoring temperature in FPGA based SoCs
S Velusamy, W Huang, J Lach, M Stan, K Skadron
2005 International Conference on Computer Design, 634-637, 2005
1162005
TAPO: Thermal-aware power optimization techniques for servers and data centers
W Huang, M Allen-Ware, JB Carter, E Elnozahy, H Hamann, T Keller, ...
2011 International Green Computing Conference and Workshops, 1-8, 2011
912011
Differentiating the roles of IR measurement and simulation for power and temperature-aware design
W Huang, K Skadron, S Gurumurthi, RJ Ribando, MR Stan
2009 IEEE International Symposium on Performance Analysis of Systems and …, 2009
902009
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Z Lu, W Huang, J Lach, M Stan, K Skadron
IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004 …, 2004
872004
PPEP: Online performance, power, and energy prediction framework and DVFS space exploration
B Su, J Gu, L Shen, W Huang, JL Greathouse, Z Wang
2014 47th Annual IEEE/ACM International Symposium on Microarchitecture, 445-457, 2014
852014
An improved block-based thermal model in hotspot 4.0 with granularity considerations
W Huang, K Sankaranarayanan, RJ Ribando, MR Stan, K Skadron
Proceedings of the Workshop on Duplicating, Deconstructing, and Debunking, 2007
712007
The need for a full-chip and package thermal model for thermally optimized IC designs
W Huang, E Humenay, K Skadron, MR Stan
Proceedings of the 2005 international symposium on Low power electronics and …, 2005
662005
Analytical model for sensor placement on microprocessors
KJ Lee, K Skadron, W Huang
2005 International Conference on Computer Design, 24-27, 2005
642005
Accurate fine-grained processor power proxies
W Huang, C Lefurgy, W Kuk, A Buyuktosunoglu, M Floyd, K Rajamani, ...
2012 45th Annual IEEE/ACM International Symposium on Microarchitecture, 224-234, 2012
562012
Design and Analysis of an APU for Exascale Computing
T Vijayaraghavan, Y Eckert, GH Loh, MJ Schulte, M Ignatowski, ...
2017 IEEE International Symposium on High Performance Computer Architecture …, 2017
542017
Parameterized physical compact thermal modeling
W Huang, MR Stan, K Skadron
IEEE Transactions on Components and Packaging Technologies 28 (4), 615-622, 2005
532005
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Artiklar 1–20