Advantages of plasma etch modeling using neural networks over statistical techniques CD Himmel, GS May IEEE Transactions on semiconductor manufacturing 6 (2), 103-111, 1993 | 260 | 1993 |
Time series modeling of reactive ion etching using neural networks MD Baker, CD Himmel, GS May IEEE Transactions on Semiconductor Manufacturing 8 (1), 62-71, 1995 | 77 | 1995 |
In-situ prediction of reactive ion etch endpoint using neural networks MD Baker, CD Himmel, GS May IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1995 | 35 | 1995 |
A comparison of statistically-based and neural network models of plasma etch behavior CD Himmel, B Kim, GS May [1992 Proceedings] IEEE/SEMI International Semiconductor Manufacturing …, 1992 | 33 | 1992 |
Real-time predictive control of semiconductor manufacturing processes using neural networks CD Himmel, TS Kim, A Krauss, EW Kamen, GS May Proceedings of 1995 American Control Conference-ACC'95 2, 1240-1244, 1995 | 17 | 1995 |
In-situ prediction of RIE time to completion using neural networks D Baker, CD Himmel, GS May Proceedings of 16th IEEE/CPMT International Electronic Manufacturing …, 1994 | 1 | 1994 |