High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages S Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J Vanfleteren IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013 | 18 | 2013 |
3-D stacking of ultrathin chip packages: An innovative packaging and interconnection technology S Priyabadini, T Sterken, L Van Hoorebeke, J Vanfleteren IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013 | 12 | 2013 |
High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based Ultra-Thin Chip package (UTCP) T Sterken, M Op de Beeck, F Vermeiren, T Torfs, L Wang, S Priyabadini, ... International Symposium on Microelectronics 2012 (1), 000940-000945, 2012 | 8 | 2012 |
Module miniaturization by ultra thin package stacking T Löher, D Schütze, A Ostmann, R Aschenbrenner 2010 IEEE CPMT Symposium Japan, 1-4, 2010 | 7 | 2010 |
An approach to produce a stack of photo definable polyimide based flat UTCPs S Priyabadini, T Sterken, L Wang, K Dhaenens, B Vandecasteele, ... 2012 4th Electronic System-Integration Technology Conference, 1-4, 2012 | 6 | 2012 |
3D-stacking of ultra-thin chips and chip packages S Priyabadini Ghent University, 2013 | 2 | 2013 |
Photo-definable polyimide-based flat UTCP technology for 3D-stacking application S Priyabadini, T Sterken, M Op de Beeck, J Vanfleteren Smart Systems Integration 2013, 2013 | 2 | 2013 |
3D-stacking of UTCPs as a module miniaturization technology S Priyabadini, A Gielen, K Dhaenens, W Christiaens, S Van Put, G Kunkel, ... International Symposium on Microelectronics 2011 (1), 000463-000468, 2011 | 2 | 2011 |
Low-resistive sulphur-treated ohmic contacts to n-type InAsSb S Arafin, A Bachmann, K Kashani-Shirazi, S Priyabadini, MC Amann IET optoelectronics 3 (6), 259-263, 2009 | 2 | 2009 |
Low-resistive ohmic contacts to n-InAs0. 91Sb0. 09 for GaSb-based VCSELs in the mid-infrared range S Arafin, A Bachmann, K Kashani-Shirazi, S Priyabadini, MC Amann Semiconductor and integrated optoelectronic conference, Cardiff, 2009 | 2 | 2009 |
3D-stacking of UTCPs as a module miniaturisation S Priyabadini, A Gielen, K Dhaenens, W Christiaens, S Van Put, G Kunkel, ... | | 2011 |