Debbie G. Senesky, Ph.D.
Debbie G. Senesky, Ph.D.
Assistant Professor, Stanford University
Verified email at - Homepage
TitleCited byYear
A SiC MEMS resonant strain sensor for harsh environment applications
RG Azevedo, DG Jones, AV Jog, B Jamshidi, DR Myers, L Chen, X Fu, ...
IEEE Sensors Journal 7 (4), 568-576, 2007
Harsh environment silicon carbide sensors for health and performance monitoring of aerospace systems: A review
DG Senesky, B Jamshidi, KB Cheng, AP Pisano
IEEE Sensors Journal 9 (11), 1472-1478, 2009
AlN/3C–SiC composite plate enabling high‐frequency and high‐Q micromechanical resonators
CM Lin, YY Chen, VV Felmetsger, DG Senesky, AP Pisano
Advanced Materials 24 (20), 2722-2727, 2012
Advances in silicon carbide science and technology at the micro-and nanoscales
R Maboudian, C Carraro, DG Senesky, CS Roper
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 31 (5 …, 2013
AlN thin films grown on epitaxial 3C–SiC (100) for piezoelectric resonant devices
CM Lin, WC Lien, VV Felmetsger, MA Hopcroft, DG Senesky, AP Pisano
Applied Physics Letters 97 (14), 141907, 2010
Solar-blind photodetectors for harsh electronics
DS Tsai, WC Lien, DH Lien, KM Chen, ML Tsai, DG Senesky, YC Yu, ...
Scientific reports 3, 2628, 2013
High-Q aluminum nitride Lamb wave resonators with biconvex edges
CM Lin, YJ Lai, JC Hsu, YY Chen, DG Senesky, AP Pisano
Applied Physics Letters 99 (14), 143501, 2011
Surface acoustic wave devices on AlN/3C–SiC/Si multilayer structures
CM Lin, YY Chen, VV Felmetsger, WC Lien, T Riekkinen, DG Senesky, ...
Journal of Micromechanics and Microengineering 23 (2), 025019, 2013
4H–SiC Metal–Semiconductor–Metal Ultraviolet Photodetectors in Operation of 450
WC Lien, DS Tsai, DH Lien, DG Senesky, JH He, AP Pisano
IEEE Electron Device Letters 33 (11), 1586-1588, 2012
Temperature sensor based on 4H-silicon carbide pn diode operational from 20 C to 600 C
N Zhang, CM Lin, DG Senesky, AP Pisano
Applied Physics Letters 104 (7), 073504, 2014
Silicon carbide resonant tuning fork for microsensing applications in high-temperature and high G-shock environments
DR Myers, KB Cheng, B Jamshidi, RG Azevedo, DG Senesky, L Chen, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 8 (2), 021116, 2009
New developments in sensing technology for structural health monitoring
SC Mukhopadhyay
Springer Science & Business Media, 2011
Anchor loss reduction in AlN Lamb wave resonators using phononic crystal strip tethers
CM Lin, JC Hsu, DG Senesky, AP Pisano
2014 IEEE International Frequency Control Symposium (FCS), 1-5, 2014
Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities
E Berkcan, S Chandrasekaran, CJ Kapusta, LJ Meyer, GS Claydon, ...
US Patent 7,221,144, 2007
Silicon carbide coated MEMS strain sensor for harsh environment applications
RG Azevedo, J Zhang, DG Jones, DR Myers, AV Jog, B Jamshidi, ...
2007 IEEE 20th International Conference on Micro Electro Mechanical Systems …, 2007
Low-temperature, ion beam-assisted SiC thin films with antireflective ZnO nanorod arrays for high-temperature photodetection
WC Lien, DS Tsai, SH Chiu, DG Senesky, R Maboudian, AP Pisano, ...
IEEE Electron Device Letters 32 (11), 1564-1566, 2011
4H-SiC N-channel JFET for operation in high-temperature environments
WC Lien, N Damrongplasit, JH Paredes, DG Senesky, TJK Liu, AP Pisano
IEEE Journal of the Electron Devices Society 2 (6), 164-167, 2014
Operation of ohmic Ti/Al/Pt/Au multilayer contacts to GaN at 600 C in air
M Hou, DG Senesky
Applied Physics Letters 105 (8), 081905, 2014
Characterization of aluminum nitride Lamb wave resonators operating at 600 C for harsh environment RF applications
TT Yen, CM Lin, X Zhao, VV Felmetsger, DG Senesky, MA Hopcroft, ...
2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems …, 2010
ZnO nanorod arrays and direct wire bonding on GaN surfaces for rapid fabrication of antireflective, high-temperature ultraviolet sensors
H So, DG Senesky
Applied Surface Science 387, 280-284, 2016
The system can't perform the operation now. Try again later.
Articles 1–20