| Forced convection cooling of additively manufactured single and double layer enhanced microchannels SS Panse, SV Ekkad International Journal of Heat and Mass Transfer 168, 120881, 2021 | 27 | 2021 |
| A thermosiphon loop for high heat flux removal using flow boiling of ethanol in OMM with taper SS Panse, SG Kandlikar International Journal of Heat and Mass Transfer 106, 546-557, 2017 | 21 | 2017 |
| Thermal hydraulic performance augmentation by high-porosity thin aluminum foams placed in high aspect ratio ducts SS Panse, P Singh, SV Ekkad Applied Thermal Engineering 161, 114162, 2019 | 8 | 2019 |
| A numerical parametric study to enhance thermal hydraulic performance of a novel alternating offset oblique microchannel SS Panse, SV Ekkad Numerical Heat Transfer, Part A: Applications 79 (7), 489-512, 2021 | 7 | 2021 |
| Air-based cooling in high porosity, aluminum foams for compact electronics cooling SS Panse, P Singh, SV Ekkad 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 6 | 2019 |
| Heat transfer enhancement through array jet impingement on strategically placed high porosity high pore-density thin copper foams VP Rajamuthu, SS Panse, S Ekkad Journal of Electronic Packaging 143 (3), 031003, 2021 | 3 | 2021 |
| Evaluation of additively manufactured single-pass and two-pass enhanced microchannel heat sinks SS Panse, SV Ekkad 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 3 | 2020 |
| Effect of channel aspect ratio and fin geometry on fluid flow and heat transfer performance of sectional oblique fin microchannels VA Rudragoudar, H Chhatija, SS Panse, S Ekkad 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 2 | 2021 |
| Thermal hydraulic performance of high porosity high pore density thin copper foams subject to array jet impingement VP Rajamuthu, SS Panse, SV Ekkad 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 2 | 2020 |
| Impingement Heat Transfer of Various Lobe-Shaped Nozzles SS Panse, S Madhavan, P Singh, SV Ekkad ASME International Mechanical Engineering Congress and Exposition 59452 …, 2019 | 2 | 2019 |
| High Porosity and High Pore Density Thin Copper Foams for Compact Electronics Cooling SS Panse, P Singh, SV Ekkad ASME International Mechanical Engineering Congress and Exposition 52125 …, 2018 | 2 | 2018 |
| Development of Advanced Cooling Technologies for High-Powered Electronic Devices SS Panse North Carolina State University, 2021 | | 2021 |
| A Thermosiphon Loop for High Heat Flux Removal using Flow Boiling of Ethanol in Open Microchannel Manifold (OMM) with Taper SS Panse Rochester Institute of Technology, 2016 | | 2016 |
Srinath EkkadDepartment Head and RJ Reynolds Professor, NC StateVerified email at ncsu.edu
