Zili Yu
Zili Yu
Head of department Sensor Systems, Institut für Mikroelektronik Stuttgart (IMS CHIPS)
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Cited by
Cited by
A prototype PZT matrix transducer with low-power integrated receive ASIC for 3-D transesophageal echocardiography
C Chen, SB Raghunathan, Z Yu, M Shabanimotlagh, Z Chen, Z Chang, ...
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 63 …, 2015
Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips
C Harendt, J Kostelnik, A Kugler, E Lorenz, S Saller, A Schreivogel, Z Yu, ...
Solid-State Electronics 113, 101-108, 2015
Design of a micro-beamformer for a 2D piezoelectric ultrasound transducer
S Blaak, Z Yu, GCM Meijer, C Prins, CT Lancee, JG Bosch, N de Jong
2009 IEEE International Ultrasonics Symposium, 1338-1341, 2009
Front-end receiver electronics for a matrix transducer for 3-D transesophageal echocardiography
Z Yu, S Blaak, ZY Chang, J Yao, JG Bosch, C Prins, CT Lancée, ...
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 59 …, 2012
Ultra‐thin smart electronic skin based on hybrid system‐in‐foil concept combining three flexible electronics technologies
M Elsobky, Y Mahsereci, Z Yu, H Richter, JN Burghartz, J Keck, H Klauk, ...
Electronics Letters 54 (6), 338-340, 2018
Ultrasound beamformer using pipeline-operated S/H delay stages and charge-mode summation
Z Yu, MAP Pertijs, GCM Meijer
Electronics letters 47 (18), 1011-1012, 2011
A programmable analog delay line for Micro-beamforming in a transesophageal ultrasound probe
Z Yu, MAP Pertijs, GCM Meijer
2010 10th IEEE international conference on solid-state and integrated …, 2010
Hybrid systems-in-foil—combining the merits of thin chips and of large-area electronics
JN Burghartz, G Alavi, B Albrecht, T Deuble, M Elsobky, S Ferwana, ...
IEEE Journal of the Electron Devices Society 7, 776-783, 2019
Ultra-thin silicon chips in flexible microsystems
J Wolf, J Kostelnik, K Berschauer, A Kugler, E Lorenz, C Harendt, Z Yu
Proceedings of the ECWC 13, 2014
Backside illuminated “Ge-on-Si” NIR camera
M Oehme, M Kaschel, S Epple, M Wanitzek, Z Yu, D Schwarz, AC Köllner, ...
IEEE Sensors Journal 21 (17), 18696-18705, 2021
Thermal characterization and modeling of ultra-thin silicon chips
M Alshahed, Z Yu, H Rempp, H Richter, C Harendt, JN Burghartz
Solid-State Electronics 113, 121-126, 2015
Measurement-based compact thermal model extraction methodology for packaged ICs
MS Alshahed, Z Yu, H Richter, C Harendt, JN Burghartz
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017
Method of manufacturing an ultrasound transducer and devices including an ultrasound transducer
C Prins, JA Ponte, Z Yu
US Patent 9,237,879, 2016
Design of a low power time-gain-compensation amplifier for a 2D piezoelectric ultrasound transducer
J Yao, Z Yu, MAP Pertijs, GCM Meijer, CT Lancée, JG Bosch, N de Jong
2010 IEEE International Ultrasonics Symposium, 841-844, 2010
Realization and opto-electronic characterization of linear self-reset pixel cells for a high dynamic CMOS image sensor
S Hirsch, M Strobel, W Klingler, JD Schulze Spüntrup, Z Yu, JN Burghartz
Advances in Radio Science 17, 239-247, 2019
A new MOSFET model for the simulation of circuits under mechanical stress
H Alius, H Rempp, Z Yu, T Gneiting
Proc. MOS-AK Workshop, 2014
Ultra-thin sensor systems integrating silicon chips with on-foil passive and active components
M Elsobky, G Alavi, B Albrecht, T Deuble, C Harendt, H Richter, Z Yu, ...
Proceedings 2 (13), 748, 2018
A new CMOS stress sensor ratiometric readout for in-plane stress magnitude and angle detection
Z Yu, C Scherjon, Y Mahsereci, JN Burghartz
2017 IEEE SENSORS, 1-3, 2017
Characterization of thin-film temperature sensors and ultra-thin chips for HySiF integration
M Elsobky, A Ottaviani, M Alomari, Z Yu, T Deuble, JN Burghartz
2019 IEEE international conference on flexible and printable sensors and …, 2019
A lithium-ion battery demonstrator for HEV applications featuring a smart system at cell level
F Saidani, FX Hutter, W Selinger, Z Yu, JN Burghartz
2017 IEEE International Systems Engineering Symposium (ISSE), 1-5, 2017
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