Multi-band antenna package structure, manufacturing method thereof and communication device CW Chiang, YC Kuan, CJ Liang, CT Yu US Patent 10,424,550, 2019 | 31 | 2019 |
Integration challenges of TSV backside via reveal process BK Huang, CM Lin, SJ Huang, CW Chiang, PC Huang, GX Chen, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 915-917, 2013 | 30 | 2013 |
A 0.6-V VDD W-Band Neutralized Differential Low Noise Amplifier in 28-nm Bulk CMOS CJ Liang, CW Chiang, J Zhou, R Huang, KA Wen, MCF Chang, YC Kuan IEEE Microwave and Wireless Components Letters 31 (5), 481-484, 2021 | 16 | 2021 |
A tri (K/Ka/V)-band monolithic CMOS low noise amplifier with shared signal path and variable gains CJ Liang, CW Chiang, J Zhou, R Huang, KA Wen, MCF Chang, YC Kuan 2020 IEEE/MTT-S International Microwave Symposium (IMS), 333-336, 2020 | 16 | 2020 |
A 23.6-38.3 GHz low-noise PLL with digital ring oscillator and multi-ratio injection-locked dividers for millimeter-wave sensing Y Zhang, Y Zhao, R Huang, CJ Liang, CW Chiang, YC Kuan, MCF Chang 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 3-6, 2020 | 14 | 2020 |
Multi-band antenna package structure, manufacturing method thereof and communication device CW Chiang, YC Kuan, CJ Liang, CT Yu US Patent 10,096,558, 2018 | 14 | 2018 |
Electronic package and fabrication method thereof CW Chiang, HW Chen, KH Chen, CC Yen, WJ Chang US Patent App. 14/833,586, 2016 | 13 | 2016 |
A W-band 4-GHz BW multiuser interference-tolerant radar with 28-nm CMOS front ends R Huang, CW Chiang, CJ Liang, Y Kim, YC Kuan, MCF Chang IEEE Solid-State Circuits Letters 3, 414-417, 2020 | 12 | 2020 |
An Ultrawide Ku- To W-Band Array Antenna Package Using Flip-Chipped Silicon Integrated Passive Device With Multilayer PCB Technology N Khiabani, CW Chiang, NC Liu, YC Kuan, CTM Wu IEEE Microwave and Wireless Components Letters 31 (7), 861-864, 2021 | 10 | 2021 |
AK/Ka/V triband single-signal-path receiver with variable-gain low-noise amplifier and constant-gain phase shifter in 28-nm CMOS CJ Liang, Y Zhang, CW Chiang, R Huang, J Zhou, J Du, KA Wen, ... IEEE Transactions on Microwave Theory and Techniques 69 (5), 2579-2593, 2021 | 9 | 2021 |
Electronic package and fabrication method thereof and substrate structure CW Chiang, KH Chen, HW Chen US Patent 10,049,973, 2018 | 8 | 2018 |
Substrate structure, electronic package and method for fabricating the electronic package CW Chiang, W Hsin-Chih, CY Shih, SC Chen US Patent 9,754,868, 2017 | 8 | 2017 |
Multi-Gbps tri-band 28/38/60-GHz CMOS transmitter for millimeter-wave radio system-on-chip D Del Rio, D Yoon, FT Chen, Y Zhang, CJ Liang, CW Chiang, ... 2019 IEEE MTT-S International Microwave Symposium (IMS), 488-491, 2019 | 7 | 2019 |
Electronic package and method of fabricating the same CW Chiang, KH Chen, SL Lu, HW Chen US Patent 9,818,683, 2017 | 7 | 2017 |
A 0.6-V VDD, 3.8-dB Minimum Noise Figure, 19.5-62.5-GHz Low Noise Amplifier in 28-nm Bulk CMOS CJ Liang, CW Chiang, J Zhou, CJ Tien, R Huang, KA Wen, MCF Chang, ... 2021 IEEE MTT-S International Microwave Symposium (IMS), 768-771, 2021 | 5 | 2021 |
A cost-effective W-band antenna-in-package using IPD and PCB technologies CW Chiang, CTM Wu, NC Liu, CJ Liang, YC Kuan IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 4 | 2022 |
Method of fabricating electronic package CW Chiang, KH Chen, SL Lu, HW Chen US Patent 10,199,320, 2019 | 4 | 2019 |
Optimization and challenges of backside via flatness reveal process KW Peng, CH Ciou, CW Chiang, CC Yen, WJ Chang, KH Chen, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1818-1821, 2015 | 4 | 2015 |
A dual W-band high-order mode substrate integrated waveguide cavity-backed antenna for radar sensing and communication applications CW Chiang, NC Liu, R Huang, CTM Wu, YC Kuan 2020 IEEE Asia-Pacific Microwave Conference (APMC), 158-160, 2020 | 3 | 2020 |
Method for manufacturing a multi-band antenna package structure CW Chiang, YC Kuan, CJ Liang, CT Yu US Patent 10,566,299, 2020 | 3 | 2020 |