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C.-W. Chiang
C.-W. Chiang
Unknown affiliation
Verified email at nycu.edu.tw
Title
Cited by
Cited by
Year
Multi-band antenna package structure, manufacturing method thereof and communication device
CW Chiang, YC Kuan, CJ Liang, CT Yu
US Patent 10,424,550, 2019
312019
Integration challenges of TSV backside via reveal process
BK Huang, CM Lin, SJ Huang, CW Chiang, PC Huang, GX Chen, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 915-917, 2013
302013
A 0.6-V VDD W-Band Neutralized Differential Low Noise Amplifier in 28-nm Bulk CMOS
CJ Liang, CW Chiang, J Zhou, R Huang, KA Wen, MCF Chang, YC Kuan
IEEE Microwave and Wireless Components Letters 31 (5), 481-484, 2021
162021
A tri (K/Ka/V)-band monolithic CMOS low noise amplifier with shared signal path and variable gains
CJ Liang, CW Chiang, J Zhou, R Huang, KA Wen, MCF Chang, YC Kuan
2020 IEEE/MTT-S International Microwave Symposium (IMS), 333-336, 2020
162020
A 23.6-38.3 GHz low-noise PLL with digital ring oscillator and multi-ratio injection-locked dividers for millimeter-wave sensing
Y Zhang, Y Zhao, R Huang, CJ Liang, CW Chiang, YC Kuan, MCF Chang
2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 3-6, 2020
142020
Multi-band antenna package structure, manufacturing method thereof and communication device
CW Chiang, YC Kuan, CJ Liang, CT Yu
US Patent 10,096,558, 2018
142018
Electronic package and fabrication method thereof
CW Chiang, HW Chen, KH Chen, CC Yen, WJ Chang
US Patent App. 14/833,586, 2016
132016
A W-band 4-GHz BW multiuser interference-tolerant radar with 28-nm CMOS front ends
R Huang, CW Chiang, CJ Liang, Y Kim, YC Kuan, MCF Chang
IEEE Solid-State Circuits Letters 3, 414-417, 2020
122020
An Ultrawide Ku- To W-Band Array Antenna Package Using Flip-Chipped Silicon Integrated Passive Device With Multilayer PCB Technology
N Khiabani, CW Chiang, NC Liu, YC Kuan, CTM Wu
IEEE Microwave and Wireless Components Letters 31 (7), 861-864, 2021
102021
AK/Ka/V triband single-signal-path receiver with variable-gain low-noise amplifier and constant-gain phase shifter in 28-nm CMOS
CJ Liang, Y Zhang, CW Chiang, R Huang, J Zhou, J Du, KA Wen, ...
IEEE Transactions on Microwave Theory and Techniques 69 (5), 2579-2593, 2021
92021
Electronic package and fabrication method thereof and substrate structure
CW Chiang, KH Chen, HW Chen
US Patent 10,049,973, 2018
82018
Substrate structure, electronic package and method for fabricating the electronic package
CW Chiang, W Hsin-Chih, CY Shih, SC Chen
US Patent 9,754,868, 2017
82017
Multi-Gbps tri-band 28/38/60-GHz CMOS transmitter for millimeter-wave radio system-on-chip
D Del Rio, D Yoon, FT Chen, Y Zhang, CJ Liang, CW Chiang, ...
2019 IEEE MTT-S International Microwave Symposium (IMS), 488-491, 2019
72019
Electronic package and method of fabricating the same
CW Chiang, KH Chen, SL Lu, HW Chen
US Patent 9,818,683, 2017
72017
A 0.6-V VDD, 3.8-dB Minimum Noise Figure, 19.5-62.5-GHz Low Noise Amplifier in 28-nm Bulk CMOS
CJ Liang, CW Chiang, J Zhou, CJ Tien, R Huang, KA Wen, MCF Chang, ...
2021 IEEE MTT-S International Microwave Symposium (IMS), 768-771, 2021
52021
A cost-effective W-band antenna-in-package using IPD and PCB technologies
CW Chiang, CTM Wu, NC Liu, CJ Liang, YC Kuan
IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022
42022
Method of fabricating electronic package
CW Chiang, KH Chen, SL Lu, HW Chen
US Patent 10,199,320, 2019
42019
Optimization and challenges of backside via flatness reveal process
KW Peng, CH Ciou, CW Chiang, CC Yen, WJ Chang, KH Chen, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1818-1821, 2015
42015
A dual W-band high-order mode substrate integrated waveguide cavity-backed antenna for radar sensing and communication applications
CW Chiang, NC Liu, R Huang, CTM Wu, YC Kuan
2020 IEEE Asia-Pacific Microwave Conference (APMC), 158-160, 2020
32020
Method for manufacturing a multi-band antenna package structure
CW Chiang, YC Kuan, CJ Liang, CT Yu
US Patent 10,566,299, 2020
32020
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