| Cooling performance of silicon-based thermoelectric device on high power LED JH Cheng, CK Liu, YL Chao, RM Tain ICT 2005. 24th International Conference on Thermoelectrics, 2005., 53-56, 2005 | 136 | 2005 |
| Au–Sn bonding material for the assembly of power integrated circuit module ZX Zhu, CC Li, LL Liao, CK Liu, CR Kao Journal of Alloys and Compounds 671, 340-345, 2016 | 94 | 2016 |
| Apparatus and method for measuring characteristic and chip temperature of LED MJ Dai, CK Liu, HC Chien, CK Yu, SL Li US Patent 8,075,182, 2011 | 75 | 2011 |
| Multi-objective optimization of heat exchanger in an automotive exhaust thermoelectric generator C Liu, YD Deng, XY Wang, X Liu, YP Wang, CQ Su Applied Thermal Engineering 108, 916-926, 2016 | 71 | 2016 |
| Thermal conductivity of Si/SiGe superlattice films CK Liu, CK Yu, HC Chien, SL Kuo, CY Hsu, MJ Dai, GL Luo, SC Huang, ... Journal of Applied Physics 104 (11), 2008 | 63 | 2008 |
| High efficiency silicon-based high power LED package integrated with micro-thermoelectric device CK Liu, MJ Dai, CK Yu, SL Kuo 2007 International Microsystems, Packaging, Assembly and Circuits Technology …, 2007 | 58 | 2007 |
| Encapsulation and methods thereof MJ Dai, CK Liu, CK Yu, SH Wu US Patent 7,633,154, 2009 | 56 | 2009 |
| Flexible thermoelectric device CK Yu, CK Liu, MJ Dai US Patent 7,999,172, 2011 | 53 | 2011 |
| Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials CC Li, F Drymiotis, LL Liao, HT Hung, JH Ke, CK Liu, CR Kao, GJ Snyder Journal of Materials Chemistry C 3 (40), 10590-10596, 2015 | 41 | 2015 |
| Electro-thermal finite element analysis and verification of power module with aluminum wire LL Liao, TY Hung, CK Liu, W Li, MJ Dai, KN Chiang Microelectronic Engineering 120, 114-120, 2014 | 39 | 2014 |
| Light emitting diode package structure MJ Dai, CK Liu, CK Yu US Patent 7,855,396, 2010 | 38 | 2010 |
| A new lattice thermal conductivity model of a thin-film semiconductor MJ Huang, TM Chang, WY Chong, CK Liu, CK Yu International Journal of Heat and Mass Transfer 50 (1-2), 67-74, 2007 | 37 | 2007 |
| Effect of non-uniform heating on the performance of the microchannel heat sinks CK Liu, SJ Yang, YL Chao, KY Liou, CC Wang International communications in heat and mass transfer 43, 57-62, 2013 | 32 | 2013 |
| Light emitting diode package structure and fabricating method thereof MJ Dai, CK Liu, CK Yu US Patent 7,586,125, 2009 | 31 | 2009 |
| Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure CK Liu, SM Chang US Patent App. 12/640,013, 2010 | 29 | 2010 |
| Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing CC Li, F Drymiotis, LL Liao, MJ Dai, CK Liu, CL Chen, YY Chen, CR Kao, ... Energy conversion and management 98, 134-137, 2015 | 27 | 2015 |
| Direct liquid cooling For IGBT power module CK Liu, YL Chao, SJ Yang, RC Fang, WK Han, J Tu, A Lin, MH Yen, ... 2014 9th International Microsystems, Packaging, Assembly and Circuits …, 2014 | 25 | 2014 |
| Thermo-mechanical analysis of thermoelectric modules SL Li, CK Liu, CY Hsu, MC Hsieh, MJ Dai, ST Wu 2010 5th International Microsystems Packaging Assembly and Circuits …, 2010 | 25 | 2010 |
| Three-dimensional stacked heat spreader assembly for electronic package and method for assembling CK Liu, ST Chiang US Patent 6,700,783, 2004 | 25 | 2004 |
| Semiconductor device CK Liu, JH Lau, MJ Dai, RM Tain US Patent 8,674,491, 2014 | 24 | 2014 |
