| Objective evaluation of stubble emission of North India and quantifying its impact on air quality of Delhi G Beig, SK Sahu, V Singh, S Tikle, SB Sobhana, P Gargeva, ... Science of The Total Environment 709, 136126, 2020 | 119 | 2020 |
| A numerical study of the thermal performance of an impingement heat sink-fin shape optimization A Shah, BG Sammakia, H Srihari, K Ramakrishna IEEE transactions on Components and Packaging Technologies 27 (4), 710-717, 2004 | 62 | 2004 |
| Size effect on the thermal conductivity of thin metallic films investigated by scanning Joule expansion microscopy SP Gurrum, WP King, YK Joshi, K Ramakrishna | 57 | 2008 |
| Thermal sub-modeling of the wirebonded plastic ball grid array package Z Johnson, K Ramakrishna, B Joiner, M Eyman Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management …, 1997 | 52 | 1997 |
| A compact approach to on-chip interconnect heat conduction modeling using the finite element method SP Gurrum, YK Joshi, WP King, K Ramakrishna, M Gall | 50 | 2008 |
| Thermal management of handheld telecommunication products TY Tom Lee, B Chambers, K Ramakrishna Electronics Cooling 4, 30-33, 1998 | 26 | 1998 |
| Two‐dimensional analysis of electrical breakdown in a nonuniform gap between a wire and a plane K Ramakrishna, IM Cohen, PS Ayyaswamy Journal of applied physics 65 (1), 41-50, 1989 | 22 | 1989 |
| Prediction of thermal performance of flip chip-plastic ball grid array (FC-PBGA) packages: effect of substrate physical design K Ramakrishna, TYT Lee ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002 | 20 | 2002 |
| Optimization study for a parallel plate impingement heat sink A Shah, BG Sammakia, K Srihari, K Ramakrishna | 17 | 2006 |
| Evaluation of Smear and its effect on the mechanical integrity of plated through hole-inner plane interface in thick printed wiring boards R Venkatraman, K Ramakrishna, K Knadle, WT Chen, GC Haddon J. Electron. Packag. 123 (1), 6-15, 2001 | 17 | 2001 |
| Heat transfer in surface-cooled objects subject to microwave heating KR Foster, PS Ayyaswamy, T Sundararajan, K Ramakrishna IEEE Transactions on Microwave Theory and Techniques 30 (8), 1158-1166, 1982 | 16 | 1982 |
| Effect of material and design parameters on the stresses induced in a Direct-Chip-Attach package during underfill cure K Ramakrishna, Z Johnson Proc. InterPack’97, 15-19, 1997 | 15 | 1997 |
| Effect of non-uniformities and defects on PTH strain during assembly and accelerated thermal cycling K Ramakrishna Proceedings of Joint ASME/JSME Conference on Electronic Packaging, 1992, 891-908, 1992 | 15 | 1992 |
| Numerical simulation of electron transport through constriction in a metallic thin film SP Gurrum, YK Joshi, WP King, K Ramakrishna IEEE electron device letters 25 (10), 696-698, 2004 | 13 | 2004 |
| Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection K Ramakrishna, TR Thomas, TYT Lee, JR Trent, JV Hause ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical …, 1998 | 13 | 1998 |
| Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications K Ramakrishna, JR Trent ASME International Mechanical Engineering Congress and Exposition 18527, 13-21, 1997 | 13 | 1997 |
| Scaling of statistical and physical electromigration characteristics in cu interconnects M Gall, M Hauschildt, P Justison, K Ramakrishna, R Hernandez, ... MRS Online Proceedings Library (OPL) 914, 0914-F06-01, 2006 | 12 | 2006 |
| Impact of on-die discrete heating on thermal performance characteristics of silicon based IC electronic packages VH Adams, K Ramakrishna ASME International Mechanical Engineering Congress and Exposition 16530, 99-106, 1999 | 12 | 1999 |
| Plated through holes in thick printed wiring boards: Interaction between design, materials, and assembly processes K Ramakrishna, WT Chen, GH Thiel, JE Steinwall ASME APPLIED MECHANICS DIVISION-PUBLICATIONS-AMD 195, 1-1, 1994 | 12 | 1994 |
| Thermal performance of a ball grid array single package technology solution under natural and forced convection cooling K Ramakrishna, TR Thomas, TY Lee, JR Trent, JV Hause Proc. Of ITHERM 1998-Sixth Intersociety Conference on Thermal and Thermo …, 1998 | 11 | 1998 |
