| A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 155 | 2020 |
| First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018 | 64 | 2018 |
| Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ... IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020 | 46 | 2020 |
| First demonstration of 28 ghz and 39 ghz transmission lines and antennas on glass substrates for 5g modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017 | 38 | 2017 |
| Miniaturized High-Performance Filters for 5G Small-Cell Applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018 | 33 | 2018 |
| Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020 | 32 | 2020 |
| Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands M Ali, AO Watanabe, TH Lin, D Okamoto, MR Pulugurtha, MM Tentzeris, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 20 | 2020 |
| Material Design and High Frequency Characterization of Novel Ultra-Low Loss Dielectric Material for 5G and 6G Applications T Kakutani, Y Suzuki, M Koh, S Sekiguchi, S Matsumura, K Oki, S Mishima, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 538-543, 2021 | 16 | 2021 |
| Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications T Kakutani, D Okamoto, Z Guan, Y Suzuki, M Ali, A Watanabe, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 653-659, 2020 | 16 | 2020 |
| Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates M Ali, A Watanabe, T Kakutani, PM Raj, RR Tummala, M Swaminathan 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1376-1382, 2020 | 15 | 2020 |
| Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules M Ali, KQ Huang, M Swaminathan, PM Raj, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 11 | 2021 |
| 3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications AO Watanabe, TH Lin, M Ali, T Ogawa, PM Raj, MM Tentzeris, ... 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019 | 9 | 2019 |
| 3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas M Ali, A Watanabe, TH Lin, MR Pulugurtha, MM Tentzeris, RR Tummala 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 960-967, 2019 | 9 | 2019 |
| Compact, meandered-line microstrip bandpass filter M Ali, T Abbas 17th IEEE International Multi Topic Conference 2014, 67-72, 2014 | 7 | 2014 |
| Advanced 5G substrates with integrated antennas M Ali Georgia Institute of Technology, 2017 | 5 | 2017 |
| Ultra-Wideband, Glass Package-Integrated Power Dividers for 5G and mm-Wave Applications M Ali, A Watanabe, TH Lin, M Tentzeris, R Tummala, PM Raj 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI …, 2019 | 3 | 2019 |
| Reliability and High-Frequency Filter Characteristics of a Low-Loss Material for 5G RF Modules T Kakutani, Y Suzuki, M Ali, S Erdogan, M Kathaperumal, M Swaminathan 2020 International Symposium on Semiconductor Manufacturing (ISSM), 1-4, 2020 | 2 | 2020 |
| Advanced Low Df Dry film Build-up Material on Glass panel for 5G application T Kakutani, Z Guan, Y Suzuki, M Ali, S Erdogan, A Watanabe, ... International Symposium on Microelectronics 2020 (1), 000201-000205, 2020 | 1 | 2020 |
| Modeling, Design and Fabrication of Miniaturized, High Performance and Integrated Passive Components for 5G and mm-Wave Applications M Ali Georgia Institute of Technology, 2020 | | 2020 |
| Applications of Packaging Technologies in Communication Systems M Ali, PM Raj, R Tummala Fundamentals of Device and Systems Packaging: Technologies and Applications …, 2019 | | 2019 |
Atom O. WatanabeResearch Staff Member at IBM ReseachVerifierad e-postadress på ibm.com
