| Structured and parameterized model order reduction L He, H Yu US Patent App. 11/858,099, 2008 | 261 | 2008 |
| Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity H Yu, J Ho, L He ACM Transactions on Design Automation of Electronic Systems (TODAES) 14 (3), 41, 2009 | 220 | 2009 |
| A Dual-mode Large-arrayed CMOS ISFET Sensor for Accurate and High-throughput pH Sensing in Biomedical Diagnosis X Huang, H Yu, X Liu, Y Jiang, M Yan, D Wu IEEE Transactions on Biomedical Engineering (TBME) 62 (9), pp2224–2233, 2015 | 88 | 2015 |
| Design Exploration of Hybrid CMOS and Memristor Circuit by New Modified Nodal Analysis W Fei, H Yu, W Zhang, KS Yeo Very Large Scale Integration (VLSI) Systems, IEEE Transactions on 20 (6 …, 2012 | 87 | 2012 |
| An energy-efficient nonvolatile in-memory computing architecture for extreme learning machine by domain-wall nanowire devices Y Wang, H Yu, L Ni, GB Huang, M Yan, C Weng, W Yang, J Zhao IEEE Transactions on Nanotechnology 14 (6), 998-1012, 2015 | 84 | 2015 |
| SqueezedText: A Real-Time Scene Text Recognition by Binary Convolutional Encoder-Decoder Network. Z Liu, Y Li, F Ren, WL Goh, H Yu AAAI Conference on Artificial Intelligence, 2018 | 74 | 2018 |
| Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power H Yu, Y Shi, L He, T Karnik Very Large Scale Integration (VLSI) Systems, IEEE Transactions on 16 (12 …, 2008 | 74 | 2008 |
| An energy-efficient digital ReRAM-crossbar-based CNN with bitwise parallelism L Ni, Z Liu, H Yu, RV Joshi IEEE Journal on Exploratory solid-state computational devices and circuits 3 …, 2017 | 68 | 2017 |
| Analysis and modeling of internal state variables for dynamic effects of nonvolatile memory devices Y Shang, W Fei, H Yu IEEE transactions on circuits and systems I: Regular papers 59 (9), 1906-1918, 2012 | 66 | 2012 |
| On-chip sub-terahertz surface plasmon polariton transmission lines in CMOS Y Liang, H Yu, HC Zhang, C Yang, TJ Cui Scientific reports 5 (1), 1-13, 2015 | 63 | 2015 |
| A Multi-agent Minority-game based Demand-response Management of Smart Buildings towards Peak Load Reduction H Huang, Y Cai, H Xu, H Yu IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2016 | 61 | 2016 |
| An energy-efficient matrix multiplication accelerator by distributed in-memory computing on binary RRAM crossbar L Ni, Y Wang, H Yu, W Yang, C Weng, J Zhao 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 280-285, 2016 | 59 | 2016 |
| Design and Analysis of Wide Frequency-Tuning-Range CMOS 60 GHz VCO by Switching Inductor Loaded Transformer W Fei, H Yu, H Fu, J Ren, KS Yeo IEEE Transactions on Circuits and Systems I (TCAS-I) 61 (3), 699-711, 2014 | 59 | 2014 |
| A contact-imaging based microfluidic cytometer with machine-learning for single-frame super-resolution processing X Huang, J Guo, X Wang, M Yan, Y Kang, H Yu PloS one 9 (8), e104539, 2014 | 58 | 2014 |
| An EScheduler-Based Data Dependence Analysis and Task Scheduling for Parallel Circuit Simulation HY Xiaoming Chen, Wei Wu, Yu Wang, Hao Yu IEEE Transactions on Circuits and Systems II 58 (10), 702-706, 2011 | 57* | 2011 |
| CMOS High Density Electrical Impedance Biosensor Array for Tumor Cell Detection Y Chen, CC Wong, TS Pui, R Nadipalli, R Weerasekera, J Chandran, ... Sensors and Actuators B: Chemical 173, 903-907, 2012 | 56 | 2012 |
| A high-sensitivity potentiometric 65-nm CMOS ISFET sensor for rapid E. coli screening Y Jiang, X Liu, TC Dang, X Huang, H Feng, Q Zhang, H Yu IEEE transactions on biomedical circuits and systems 12 (2), 402-415, 2018 | 52 | 2018 |
| A GPU-Outperforming FPGA Accelerator Architecture for Binary Convolutional Neural Networks Y LI, Z LIU, KAI XU, HAO YU, F REN ACM Journal on Emerging Technologies in Computing (JETC), 2018 | 52 | 2018 |
| A 2-D distributed power combining by metamaterial-based zero phase shifter for 60-GHz power amplifier in 65-nm CMOS W Fei, H Yu, Y Shang, KS Yeo IEEE Transactions on Microwave Theory and Techniques (TMTT) 61 (5), 505-516, 2013 | 52 | 2013 |
| Simultaneous power and thermal integrity driven via stapling in 3D ICs H Yu, J Ho, L He Proceedings of the 2006 IEEE/ACM international conference on Computer-aided …, 2006 | 52 | 2006 |
Lei HeProfessor of Electric Engineering, University of California, Los AngelesVerifierad e-postadress på ee.ucla.edu
