| Discrete electronic component arrangement including anchoring, thermally conductive pad CK Nah, MD Stillabower, B Pan, SY Yong, P Gromala US Patent 7,148,554, 2006 | 41 | 2006 |
| High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package A Inamdar, YH Yang, A Prisacaru, P Gromala, B Han Polymer Degradation and Stability 188, 109572, 2021 | 32 | 2021 |
| Internal stress state measurements of the large molded electronic control units P Gromala, S Fischer, T Zoller, A Andreescu, J Duerr, M Rapp, J Wilde 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | 26 | 2013 |
| Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor A Palczynska, A Prisacaru, PJ Gromala, B Han, D Mayer, T Melz 2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016 | 25 | 2016 |
| Prognostics and health monitoring of electronic system: A review A Prisacaru, PJ Gromala, MB Jeronimo, B Han, GQ Zhang 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 24 | 2017 |
| Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions B Wu, DS Kim, B Han, A Palczynska, PJ Gromala 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 22 | 2015 |
| In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor A Palczynska, PJ Gromala, D Mayer, B Han, T Melz 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 21 | 2015 |
| Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application P Gromala, B Muthuraman, B Öztürk, KMB Jansen, L Ernst 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 17 | 2015 |
| Degradation estimation and prediction of electronic packages using data-driven approach A Prisacaru, P Gromala, B Han, GQ Zhang IEEE transactions on industrial electronics 69 (3), 2996-3006, 2021 | 16 | 2021 |
| Electronic control package model calibration using moiré interferometry DS Kim, B Han, A Yadur, PJ Gromala 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 16 | 2014 |
| Cure dependent characterisation of moulding compounds KMB Jansen, M Hawryluk, P Gromala 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 14 | 2011 |
| Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving M Hager, P Gromala, B Wunderle, S Rzepka Advanced Microsystems for Automotive Applications 2018: Smart Systems for …, 2019 | 13 | 2019 |
| Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor A Prisacaru, A Palczynska, A Theissler, P Gromala, B Han, GQ Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018 | 13 | 2018 |
| Prognostic approaches for the wirebond failure prediction in power semiconductors: A case study using DPAK package P Gromala, A Palczynska, B Han 2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015 | 13 | 2015 |
| Volumetric effective cure shrinkage measurement of dual curable adhesives by fiber Bragg grating sensor SP Phansalkar, C Kim, B Han, PJ Gromala Journal of materials science 55 (22), 9655-9664, 2020 | 12 | 2020 |
| Accuracy of CMOS-based piezoresistive stress sensor for engineering applications of thermal loading condition: Theoretical review and experimental validation A Prisacaru, A Palczynska, P Gromala, B Wu, B Han, G Zhang IEEE Sensors Journal 19 (20), 9139-9148, 2019 | 12 | 2019 |
| Degradation prediction of electronic packages using machine learning A Prisacaru, EO Guerrero, PJ Gromala, B Han, GQ Zhang 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 12 | 2019 |
| Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter B Wu, DS Kim, B Han, A Palczynska, A Prisacaru, PJ Gromala IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 12 | 2018 |
| Comprehensive material characterization and method of its validation by means of FEM simulation P Gromala, J Duerr, M Dressler, KMB Jansen, M Hawryluk, J De Vreugd 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 12 | 2011 |
| Towards virtual twin for electronic packages in automotive applications A Prisacaru, EO Guerrero, B Chimmineni, PJ Gromala, YH Yang, B Han, ... Microelectronics Reliability 122, 114134, 2021 | 9 | 2021 |
Bongtae HanProfessor of Mechanical Engineering, University of MarylandVerifierad e-postadress på umd.edu
