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Co-authors
- Shinji HaraUniversity of TokyoVerified email at ipc.i.u-tokyo.ac.jp
- Tae-Hyoung KimProfessor, School of Mechanical Engineering, Chung-Ang UniversityVerified email at cau.ac.kr
- teD iwasakiUCLA Mechanical & Aerospace EngineeringVerified email at ucla.edu
- Sebastian J. MaerklAssociate Professor, Institute of Bioengineering, EPFLVerified email at epfl.ch
- Henrike NiederholtmeyerTechnical University of MunichVerified email at tum.de
- Enoch YeungAssociate Professor, Department of Mechanical Engineering, University of California Santa BarbaraVerified email at ucsb.edu
- Masaaki TakadaToshiba CorporationVerified email at toshiba.co.jp
- Taishi KotsukaPostdoctoral researcher at Mechanical Engineering of University of California, Santa BarbaraVerified email at ucsb.edu
- Victoria HsiaoAmyrisVerified email at amyris.com
- Yongqiang WangClemson UniversityVerified email at engr.ucsb.edu
- Francis DoyleHarvard UniversityVerified email at seas.harvard.edu
- Paul W.K. RothemundCalifornia Institute of TechnologyVerified email at dna.caltech.edu
- Adam R. AbateUniversity of California, San FranciscoVerified email at abatelab.org
- Chaitanya KantakYale UniversityVerified email at yale.edu
- Sei Zhen KhongVerified email at eee.hku.hk
- Koki YoshidaTokyo Institute of TechnologyVerified email at keio.jp
- Ryuji KawanoTokyo University of Agriculture and Technology (TUAT)Verified email at cc.tuat.ac.jp
- Tomohiko NakamuraNational Institute of Advanced Industrial Science and Technology (AIST)Verified email at ieee.org
- Ryuki SuzukiKeio University, Ph.D. in EngineeringVerified email at keio.jp
- Mustafa KhammashDepartment of Biosystems Science and Engineering, ETH ZurichVerified email at bsse.ethz.ch