anil kunwar
Title
Cited by
Cited by
Year
In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process
L Qu, HT Ma, HJ Zhao, A Kunwar, N Zhao
Applied surface science 305, 133-138, 2014
282014
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
H Ma, A Kunwar, J Sun, B Guo, H Ma
Scripta Materialia 107, 88-91, 2015
272015
A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder
HT Ma, J Wang, L Qu, N Zhao, A Kunwar
Journal of electronic materials 42 (8), 2686-2695, 2013
242013
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
A Kunwar, H Ma, H Ma, J Sun, N Zhao, M Huang
Materials Letters 172, 211-215, 2016
212016
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
B Guo, A Kunwar, N Zhao, J Chen, Y Wang, H Ma
Materials research bulletin 99, 239-248, 2018
172018
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ...
Intermetallics 93, 186-196, 2018
142018
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints
A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ...
Microelectronics Reliability 80, 55-67, 2018
132018
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints
H Ma, A Kunwar, B Guo, J Sun, C Jiang, Y Wang, X Song, N Zhao, H Ma
Applied Physics A 122 (12), 1052, 2016
122016
On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
A Kunwar, H Ma, H Ma, B Guo, Z Meng, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 27 (7), 7699-7706, 2016
112016
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint
S Shang, Y Wang, Y Wang, H Ma, A Kunwar
Microelectronic Engineering 208, 47-53, 2019
102019
Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity
S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang
Applied Physics A 124 (7), 492, 2018
102018
Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows
H Ma, A Kunwar, R Huang, J Chen, Y Wang, N Zhao, H Ma
Intermetallics 90, 90-96, 2017
102017
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling …
B Guo, H Ma, C Jiang, Y Wang, A Kunwar, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 28 (7), 5398-5406, 2017
102017
Modeling the diffusion-driven growth of a pre-existing gas bubble in molten tin
A Kunwar, H Ma, J Sun, S Li, J Liu
Metals and Materials International 21 (5), 962-970, 2015
102015
Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows
HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao
Intermetallics 96, 1-12, 2018
82018
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux
S Shang, A Kunwar, J Yao, H Ma, Y Wang
Thin Solid Films 669, 198-207, 2019
72019
Geometrical effects of Cu@ Ag core–shell nanoparticles treated flux on the growth behaviour of intermetallics in Sn/Cu solder joints
S Shang, A Kunwar, Y Wang, J Yao, Y Wu, H Ma, Y Wang
Electronic Materials Letters 15 (2), 253-265, 2019
62019
Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows
H Ma, H Ma, A Kunwar, S Shang, Y Wang, J Chen, M Huang, N Zhao
Journal of Materials Science: Materials in Electronics 29 (1), 602-613, 2018
62018
Modelling the melting of Sn0. 7Cu solder using the enthalpy method
A Kunwar, J Givernaud, H Ma, Z Meng, S Shang, Y Wang, H Ma
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
62016
A numerical model for diffusion driven gas bubble growth in molten Sn-based solder
A Kunwar, H Ma, J Sun, L Qu, S Li, J Liu
2014 15th International Conference on Electronic Packaging Technology, 602-605, 2014
62014
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