| Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores Y Su, G Fu, C Liu, K Zhang, L Zhao, C Liu, A Liu, J Song Computer Methods in Applied Mechanics and Engineering 378, 113729, 2021 | 37 | 2021 |
| Modification of surface morphology to enhance tribological properties for CVD coated cutting tools through wet micro-blasting post-process C Liu, Z Liu, B Wang Ceramics International 44 (3), 3430-3439, 2018 | 35 | 2018 |
| Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects C Liu, A Liu, Y Su, Y Chen, Z Zhou, C Liu Journal of Manufacturing Processes 73, 139-148, 2022 | 11 | 2022 |
| Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections C Liu, A Liu, Y Zhong, S Robertson, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1999-2004, 2020 | 9 | 2020 |
| Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation Y Su, G Fu, C Liu, C Liu, X Long Microelectronics Reliability 126, 114244, 2021 | 8 | 2021 |
| Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging C Liu, A Liu, Y Su, Z Zhou, C Liu Microelectronics Reliability 126, 114241, 2021 | 8 | 2021 |
| Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding Y Chen, S Liang, C Liu, C Liu, Z Zhou 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 451-459, 2021 | 6 | 2021 |
| Transient liquid phase bonding with Ga-based alloys for electronics interconnections Y Chen, C Liu, Z Zhou, C Liu Journal of Manufacturing Processes 84, 1310-1319, 2022 | 5 | 2022 |
| Quasi-ambient Bonding Semiconductor Components for Power Electronics Integration Y Zhong, AY Liu, S Robertson, S Liang, C Liu, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1468-1473, 2020 | 4 | 2020 |
| Preparation and Application of Cu-Ag Composite Preforms for Power Electronic Packaging D Zhang, S Liu, H Xiang, L Liu, Z Zhou, S Robertson, C Liu, Z Chen, C Liu 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 63-68, 2019 | 4 | 2019 |
| Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests C Chen, D Kim, Y Liu, T Sekiguchi, Y Su, X Long, C Liu, C Liu, ... Journal of Materials Research and Technology 24, 8967-8983, 2023 | 3 | 2023 |
| Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding S Liang, Y Zhong, S Robertson, A Liu, H Jiang, C Liu, Z Zhou, C Liu Microelectronics Reliability 138, 114654, 2022 | 2 | 2022 |
| Advanced Pb-free interconnect materials and manufacture processes to enable high-temperature electronics packaging C Liu Loughborough University, 2022 | 1 | 2022 |
| Mechanical Properties of Intermetallic Compounds at Elevated Temperature by Nanoindentation F Yang, S Liu, Z Zhou, Z Chen, L Liu, C Liu, C Liu 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 850-854, 2019 | 1 | 2019 |
| TiN 刀具涂层抗多次冲击性能研究 刘灿宇， 刘战强 现代制造工程 454 (7), 105, 2018 | 1 | 2018 |
| TiN/Al_2O_3/TiCN 和 Al_2O_3/TiCN 涂层刀具湿式微喷砂后处理工艺 刘灿宇 山东大学, 2018 | 1 | 2018 |
| Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging C Liu, H Jiang, S Liang, A Liu, Z Zhou, C Liu 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 439-442, 2022 | | 2022 |
| Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging C Liu, A Liu, Z Zhou, C Liu 2022 IEEE CPMT Symposium Japan (ICSJ), 29-32, 2022 | | 2022 |
| Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging C Liu, A Liu, H Jiang, S Liang, Z Zhou, C Liu Microelectronics Reliability 138, 114688, 2022 | | 2022 |
| Characterization for repeated impact resistance of TiN tool coatings L Canyu, L Zhanqiang Modern Manufacturing Engineering 454 (7), 105, 2018 | | 2018 |
Allan Y LiuUniversity of SheffieldVerified email at sheffield.ac.uk
