En-Xiao Liu
En-Xiao Liu
Senior Scientist & Deputy Dept. Director, A*STAR Institute of High Performance Computing
Verifierad e-postadress på ihpc.a-star.edu.sg - Startsida
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Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
EP Li, XC Wei, AC Cangellaris, EX Liu, YJ Zhang, M D'amore, J Kim, ...
IEEE Transactions on Electromagnetic Compatibility 52 (2), 248-265, 2010
1472010
A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects
EP Li, EX Liu, LW Li, MS Leong
IEEE Transactions on Advanced packaging 27 (1), 213-223, 2004
1032004
Compact wideband equivalent-circuit model for electrical modeling of through-silicon via
EX Liu, EP Li, WB Ewe, HM Lee, TG Lim, S Gao
IEEE transactions on microwave theory and techniques 59 (6), 1454-1460, 2011
762011
Efficient simulation of power distribution network by using integral-equation and modal-decoupling technology
XC Wei, EP Li, EX Liu, R Vahldieck
IEEE transactions on microwave theory and techniques 56 (10), 2277-2285, 2008
512008
Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation
XC Wei, EP Li, EX Liu, X Cui
IEEE transactions on electromagnetic compatibility 50 (3), 740-743, 2008
502008
A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
ZZ Oo, EX Liu, EP Li, X Wei, Y Zhang, M Tan, LWJ Li, R Vahldieck
IEEE transactions on advanced packaging 31 (2), 267-274, 2008
502008
An effective and efficient approach for radiated emission prediction based on amplitude-only near-field measurements
WJ Zhao, BF Wang, EX Liu, HB Park, HH Park, E Song, EP Li
IEEE transactions on electromagnetic compatibility 54 (5), 1186-1189, 2012
412012
Novel methods for modeling of multiple vias in multilayered parallel-plate structures
EX Liu, EP Li, ZZ Oo, X Wei, Y Zhang, R Vahldieck
IEEE transactions on microwave theory and techniques 57 (7), 1724-1733, 2009
402009
Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors
YJ Zhang, ZZ Oo, XC Wei, EX Liu, J Fan, EP Li
IEEE Transactions on Electromagnetic Compatibility 52 (2), 401-409, 2010
322010
Interconnect design and analysis for through silicon interposers (TSIs)
JR Cubillo, R Weerasekera, ZZ Oo, EX Liu, B Conn, S Bhattacharya, ...
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE …, 2011
292011
Finite-difference time-domain macromodel for simulation of electromagnetic interference at high-speed interconnects
EX Liu, EP Li, LW Li, Z Shen
IEEE transactions on magnetics 41 (1), 65-71, 2005
282005
Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method
XC Wei, EP Li, EX Liu, EK Chua, ZZ Oo, R Vahldieck
IEEE transactions on advanced packaging 31 (3), 536-543, 2008
252008
An iterative approach for EMI source reconstruction based on phaseless and single-plane near-field scanning
YF Shu, XC Wei, R Yang, EX Liu
IEEE Transactions on Electromagnetic Compatibility 60 (4), 937-944, 2017
242017
Cascaded microwave network approach for power and signal integrity analysis of multilayer electronic packages
ZZ Oo, EX Liu, XC Wei, Y Zhang, EP Li
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011
222011
Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network
ZZ Oo, EP Li, XC Wei, EX Liu, YJ Zhang, LWJ Li
IEEE transactions on electromagnetic compatibility 51 (3), 784-791, 2009
182009
Two-dimensional discontinuous Galerkin time-domain method for modeling of arbitrarily shaped power-ground planes
HM Lee, S Gao, EX Liu, GS Samudra, EP Li
IEEE Transactions on Electromagnetic Compatibility 57 (6), 1744-1747, 2015
162015
Analysis of multilayer planar circuits by a hybrid method
EX Liu, EP Li, LW Li
IEEE microwave and wireless components letters 16 (2), 66-68, 2006
152006
Modeling of advanced multilayered packages with multiple vias and finite ground planes
EX Liu, X Wei, ZZ Oo, EP Li, LW Li
2007 IEEE Electrical Performance of Electronic Packaging, 275-278, 2007
142007
3D traffic noise mapping using unstructured surface mesh representation of buildings and roads
WJ Zhao, EX Liu, HJ Poh, B Wang, SP Gao, CE Png, KW Li, SH Chong
Applied Acoustics 127, 297-304, 2017
132017
Recent advances in electromagnetic compatibility of 3D-ICs—Part II
E Sicard, W Jianfei, R Shen, EP Li, EX Liu, J Kim, J Cho, M Swaminathan
IEEE Electromagnetic Compatibility Magazine 5 (1), 65-74, 2016
112016
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