| Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film HC Chien, DJ Yao, MJ Huang, TY Chang Review of scientific instruments 79 (5), 2008 | 108 | 2008 |
| Apparatus and method for measuring characteristic and chip temperature of LED MJ Dai, CK Liu, HC Chien, CK Yu, SL Li US Patent 8,075,182, 2011 | 75 | 2011 |
| Thermal conductivity of Si/SiGe superlattice films CK Liu, CK Yu, HC Chien, SL Kuo, CY Hsu, MJ Dai, GL Luo, SC Huang, ... Journal of Applied Physics 104 (11), 2008 | 63 | 2008 |
| Measurement and evaluation of the interfacial thermal resistance between a metal and a dielectric HC Chien, DJ Yao, CT Hsu Applied physics letters 93 (23), 2008 | 62 | 2008 |
| Thermal module with heat reservoir and method of applying the same on electronic products MH Tseng, HC Chien, CY Wang US Patent App. 10/978,451, 2005 | 59 | 2005 |
| Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications HC Chien, JH Lau, YL Chao, MJ Dai, RM Tain, L Li, P Su, J Xue, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1866-1873, 2012 | 52 | 2012 |
| Through-silicon hole interposers for 3-D IC integration JH Lau, CK Lee, CJ Zhan, ST Wu, YL Chao, MJ Dai, RM Tain, HC Chien, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (9 …, 2014 | 51 | 2014 |
| Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration L Li, P Su, J Xue, M Brillhart, J Lau, PJ Tzeng, CK Lee, CJ Zhan, MJ Dai, ... 2012 IEEE 62nd electronic components and technology conference, 1040-1046, 2012 | 50 | 2012 |
| Performance and process comparison between glass and Si interposer for 3D-IC integration CH Chien, CK Lee, H Yu, CC Liu, PS Chen, HC Chien, JH Cheng, ... International Symposium on Microelectronics 2013 (1), 000618-000624, 2013 | 34 | 2013 |
| Feasibility study of a 3D IC integration system-in-packaging (SiP) from a 300mm multi-project wafer (MPW) JH Lau, CJ Zhan, PJ Tzeng, CK Lee, MJ Dai, HC Chien, YL Chao, W Li, ... International Symposium on Microelectronics 2011 (1), 000446-000454, 2011 | 27 | 2011 |
| Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP CJ Zhan, PJ Tzeng, JH Lau, MJ Dai, HC Chien, CK Lee, ST Wu, KS Kao, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 548-554, 2012 | 25 | 2012 |
| Thermal performance of 3D IC integration with through-silicon via (TSV) HC Chien, JH Lau, YL Chao, RM Tain, MJ Dai, ST Wu, WC Lo, MJ Kao Journal of microelectronics and electronic packaging 9 (2), 97-103, 2012 | 24 | 2012 |
| Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices MJ Dai, CK Liu, HC Chien, LL Liao, KW Wang, YL Tzeng, YB Lin US Patent 8,609,454, 2013 | 22 | 2013 |
| Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips ST Wu, HC Chien, JH Lau, M Li, J Cline, M Ji 2013 IEEE 63rd Electronic Components and Technology Conference, 1471-1479, 2013 | 22 | 2013 |
| Thermal Management of Moore’s Law Chips on Both sides of an Interposer for 3D IC integration SiP HC Chien, JH Lau, T Chao, M Dai, R Tain IEEE ICEP Proceedings, 38-44, 2012 | 20 | 2012 |
| Characteristics of thermal resistance for high power LEDs SL Kuo, CK Liu, MJ Dai, CK Yu, HC Chien, CY Hsu 2008 10th Electronics Packaging Technology Conference, 149-154, 2008 | 20 | 2008 |
| Method for determining the thermal performance of a heat sink HC Chien, MH Tseng, WW Ke, CY Wang, YS Chen US Patent 6,663,278, 2003 | 20 | 2003 |
| Estimation for equivalent thermal conductivity of silicon-through vias TSVs used for 3D IC integration HC Chien, JH Lau, YL Chao, RM Tain, MJ Dai, WC Lo, MJ Kao 2011 6th International Microsystems, Packaging, Assembly and Circuits …, 2011 | 15 | 2011 |
| Evaluation of temperature-dependent effective material properties and performance of a thermoelectric module HC Chien, ET Chu, HL Hsieh, JY Huang, ST Wu, MJ Dai, CK Liu, DJ Yao Journal of electronic materials 42, 2362-2370, 2013 | 14 | 2013 |
| Filled through-silicon via with conductive composite material MJ Dai, HC Chien, MC Hsieh, JF Hung, RM Tain, JH Lau US Patent 8,456,017, 2013 | 14 | 2013 |
