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Co-authors
- Kapil GulatiQualcomm ResearchVerified email at qti.qualcomm.com
- Gabi SarkisQualcommVerified email at mail.mcgill.ca
- Sundeep RanganProfessor, ECE, New York University and Associate Director, NYU WirelessVerified email at nyu.edu
- Marco MezzavillaPolitecnico di Milano, Pi-RadioVerified email at polimi.it
- Menglei ZhangNew York UniversityVerified email at nyu.edu
- Russell D FordSamsung Research AmericaVerified email at nyu.edu
- Michele ZorziDept. of Information Engineering - University of Padova, ItalyVerified email at dei.unipd.it
- Navid AbediniQualcomm, Texas A&M, Sharif UniversityVerified email at qti.qualcomm.com
- C. Nicolas BaratiRice UniversityVerified email at rice.edu
- Michele PoleseNortheastern UniversityVerified email at northeastern.edu
- James BuckwalterUniversity of California - Santa BarbaraVerified email at ucsb.edu
- Preeti KumariUniversity of Texas as AustinVerified email at utexas.edu
- Aditya DhananjayNew York UniversityVerified email at courant.nyu.edu
- Mustafa Riza AkdenizIntel LabsVerified email at intel.com
- Hong ChengQualcomm IncVerified email at qti.qualcomm.com
- David RamirezSenior Research Engineer, DOCOMO Innovations, Inc.Verified email at docomoinnovations.com
- Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
- Christoph StuderAssociate Professor at the Dept. of Information Technology and Electrical Engineering, ETH ZurichVerified email at ethz.ch
- Panagiotis SkrimponisSr. Hardware Engineer, Samsung Research America, Inc.Verified email at samsung.com
- Seyed Hadi MirfarshbafanIntegrated Systems Laboratory (IIS), ETH ZürichVerified email at iis.ee.ethz.ch