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Sung-Kwon Kang
Sung-Kwon Kang
IBM Research retired
Verifierad e-postadress på us.ibm.com
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Observation of the Structure of Grain Boundaries in Thin Bicrystal Films Produced by a New Technique
F Cosandey, SK Kang, CL Bauer
J. Phys.(Paris) 36 (10), 1975
1975
Precipitation in Thin Foils of A1-4 Wt.% Cu Alloys
SK Kang
Graduate School of Arts and Sciences, University of Pennsylvania, 1973
1973
Precipitation in Thin Foils of Al-4 Wt per cent Cu Alloys
SK Kang
Pennsylvania Univ., Philadelphia. 1973, 284, 1973
1973
The Evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders during High Temperature Aging
SKSSK Kang, DY Shih, HM Lee
Korea 305, 701, 0
An Overview of Lead (Pb)-Free Solders and Soldering Technologies in Microelectronics
SK Kang
Study on Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction Analysis
S Cho, J Yu, SK Kang, DY Shih
Study of Oxidation of Sn-Pb Solders for Microelectronic Applications
S Cho, J Yu, SK Kang, DY Shih
Special Issue Papers
S Jin, DR Frear, JW Morris Jr, J Glazer, SK Kang, AK Sarkhel, EP Wood, ...
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Artiklar 1–8