| Wide-angle structured light with a scanning MEMS mirror in liquid X Zhang, SJ Koppal, R Zhang, L Zhou, E Butler, H Xie Optics express 24 (4), 3479-3487, 2016 | 57 | 2016 |
| Thermal resistance analysis of Sn-Bi solder paste used as thermal interface material for power electronics applications R Zhang, J Cai, Q Wang, J Li, Y Hu, H Du, L Li Journal of Electronic Packaging 136 (1), 011012, 2014 | 41 | 2014 |
| Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020 | 32 | 2020 |
| Innovative Sub-5- m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects F Liu, G Khurana, R Zhang, A Watanabe, BH DeProspo, C Nair, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 22 | 2019 |
| Advances in high performance RDL technologies for enabling IO density of 500 IOs/mm/layer and 8-μm IO pitch using low-k dielectrics F Liu, R Zhang, BH DeProspo, S Dwarakanath, P Nimbalkar, ... 2020 IEEE 70th electronic components and technology conference (ECTC), 1132-1139, 2020 | 18 | 2020 |
| Smaller microvias for packaging interconnects by picosecond UV laser with a nanometer metal barrier layer: A feasibility study F Liu, R Zhang, G Khurana, BH Deprospo, RR Tummala, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 14 | 2020 |
| Via-in-trench: A revolutionary panel-based package rdl configuration capable of 200-450 io/mm/layer, an innovation for more-than-moore system integration F Liu, C Nair, A Kubo, T Ando, H Lu, R Zhang, H Chen, KS Lee, ... 2017 IEEE 67th electronic components and technology conference (ECTC), 2097-2103, 2017 | 10 | 2017 |
| Silver-based thermal interface materials with low thermal resistance H Yu, R Zhang, L Li, X Mao, H Du 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 9 | 2012 |
| MEMS mirrors submerged in liquid for wide-angle scanning X Zhang, R Zhang, S Koppal, L Butler, X Cheng, H Xie 2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015 | 8 | 2015 |
| Cointegration of single-mode waveguides and embedded electrical interconnects for high-bandwidth communications R Zhang, F Liu, M Kathaperumal, M Swaminathan, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 6 | 2020 |
| Low cost panel-based 1-2 micron RDL technologies with lower resistance than Si BEOL for large packages F Liu, H Ito, R Zhang, BH DeProspo, F Benthaus, H Akimaru, K Hasegawa, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 613-618, 2018 | 6 | 2018 |
| First demonstration of single-mode polymer optical waveguides with circular cores for fiber-to-waveguide coupling in 3D glass photonic interposers R Zhang, F Liu, V Sundaram, R Tummala 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1606-1611, 2017 | 4 | 2017 |
| Co-integration of High-Bandwidth Photonic and Electronic RDL on 2.5 D Glass Interposers Using Low Optical Absorption Photoimageable Dielectric Polymer R Zhang, F Liu, M Gallagher, E Anzures, V Sundaram, R Tummala 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1130-1135, 2018 | 1 | 2018 |
| Polymer waveguide photonic interconnect for multichip communications-based heterogeneous integration RM Krishna, R Zhang, S Ravichandran, T Fan, AH Hosseinnia, ... Journal of Nanophotonics 16 (3), 036002-036002, 2022 | | 2022 |
| Design and optimization of photonic interconnect for heterogenous integration RK VS, R Zhang, M Kathaperumal, F Liu, M Swaminathan, A Adibi Photonic and Phononic Properties of Engineered Nanostructures XI 11694, 1169424, 2021 | | 2021 |
