| Role of fluorocarbon film formation in the etching of silicon, silicon dioxide, silicon nitride, and amorphous hydrogenated silicon carbide T Standaert, C Hedlund, EA Joseph, GS Oehrlein, TJ Dalton Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 22 (1 …, 2004 | 335 | 2004 |
| Dual etch stop/diffusion barrier for damascene interconnects DC Edelstein, TJ Dalton, JG Gaudiello, M Krishnan, SG Malhotra, ... US Patent 6,153,935, 2000 | 329 | 2000 |
| Intelligent wireless power charging system L Clevenger, T Dalton, L Hsu, C Radens US Patent 8,024,012, 2011 | 287 | 2011 |
| Post metalization chem-mech polishing dielectric etch TJ Dalton, JP Hummel US Patent 6,551,924, 2003 | 238 | 2003 |
| Double-sided integrated circuit chips K Bernstein, T Dalton, JP Gambino, MD Jaffe, PD Kartschoke, SE Luce, ... US Patent 8,421,126, 2013 | 234 | 2013 |
| Apparatus and method for real-time measurement of thin film layer thickness and changes thereof HH Sawin, WT Conner, TJ Dalton, EM Sachs US Patent 5,450,205, 1995 | 216 | 1995 |
| Dual damascene structure and method K Kumar, DC La Tulipe, T Dalton, L Clevenger, A Cowley, E Kaltalioglu, ... US Patent 7,125,792, 2006 | 203 | 2006 |
| Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters LP Buchwalter, KK Chan, TJ Dalton, CV Jahnes, JL Lund, KS Petrarca, ... US Patent 7,943,412, 2011 | 180 | 2011 |
| Method of fabricating micro-electromechanical switches on CMOS compatible substrates RP Volant, JC Bisson, DR Cote, TJ Dalton, RA Groves, KS Petrarca, ... US Patent 6,635,506, 2003 | 178 | 2003 |
| Closed air gap interconnect structure KL Saenger, M Surendra, SV Nitta, S Purushothaman, ME Colburn, ... US Patent 7,361,991, 2008 | 177 | 2008 |
| Multilayer interconnect structure containing air gaps and method for making KE Babich, RA Carruthers, TJ Dalton, A Grill, JC Hedrick, CV Jahnes, ... US Patent 6,815,329, 2004 | 166 | 2004 |
| Copper recess process with application to selective capping and electroless plating ST Chen, TJ Dalton, KM Davis, CK Hu, FF Jamin, SK Kaldor, M Krishnan, ... US Patent 6,975,032, 2005 | 139 | 2005 |
| Wafer-to-wafer alignments TJ Dalton, JP Gambino, MD Jaffe, SE Luce, EJ Sprogis US Patent 7,193,423, 2007 | 131 | 2007 |
| Very low effective dielectric constant interconnect structures and methods for fabricating the same DF Canaperi, TJ Dalton, SM Gates, M Krishnan, SV Nitta, ... US Patent 7,045,453, 2006 | 131 | 2006 |
| Very low effective dielectric constant interconnect Structures and methods for fabricating the same DF Canaperi, TJ Dalton, SM Gates, M Krishnan, SV Nitta, ... US Patent 7,023,093, 2006 | 123 | 2006 |
| Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same L Clevenger, TJ Dalton, L Hsu, C Radens, V Ramachandran, KKH Wong, ... US Patent 7,531,407, 2009 | 117 | 2009 |
| Effect of plasma interactions with low-κ films as a function of porosity, plasma chemistry, and temperature MA Worsley, SF Bent, SM Gates, N Fuller, W Volksen, M Steen, T Dalton Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2005 | 106 | 2005 |
| Method for forming a porous dielectric material layer in a semiconductor device and device formed TJ Dalton, SE Greco, JC Hedrick, SV Nitta, S Purushothaman, KP Rodbell, ... US Patent 6,451,712, 2002 | 99 | 2002 |
| Patterning of fluorine-, hydrogen-, and carbon-containing -like low dielectric constant materials in high-density fluorocarbon plasmas: Comparison with T Standaert, PJ Matsuo, SD Allen, GS Oehrlein, TJ Dalton Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17 (3 …, 1999 | 95 | 1999 |
| Low open-area endpoint detection using a PCA-based T/sup 2/statistic and Q statistic on optical emission spectroscopy measurements DA White, BE Goodlin, AE Gower, DS Boning, H Chen, HH Sawin, ... IEEE Transactions on Semiconductor Manufacturing 13 (2), 193-207, 2000 | 83 | 2000 |
