| Optimization of rule-based energy management strategies for hybrid vehicles using dynamic programming D Zhu, E Pritchard, SR Dadam, V Kumar, Y Xu arXiv preprint arXiv:2207.06450, 2022 | 77 | 2022 |
| Misconception of thermal spreading angle and misapplication to IGBT power modules Y Xu, DC Hopkins 2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 545-551, 2014 | 43 | 2014 |
| 6.0 kV, 100A, 175kHz super cascode power module for medium voltage, high power applications B Gao, AJ Morgan, Y Xu, X Zhao, DC Hopkins 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 1288-1293, 2018 | 36 | 2018 |
| Flexible epoxy-resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality X Zhao, B Gao, Y Jiang, L Zhang, S Wang, Y Xu, K Nishiguchi, Y Fukawa, ... 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4011-4018, 2017 | 35 | 2017 |
| Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module AJ Morgan, Y Xu, DC Hopkins, I Husain, W Yu 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 2141-2146, 2016 | 30 | 2016 |
| Development of an ultra-high density power chip on bus (PCoB) module Y Xu, I Husain, H West, W Yu, D Hopkins 2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2016 | 29 | 2016 |
| Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules D Rahman, AJ Morgan, Y Xu, R Gao, W Yu, DC Hopkins, I Husain 2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2016 | 27 | 2016 |
| 6.5 kv sic jfet-based super cascode power module with high avalanche energy handling capability B Gao, A Morgan, Y Xu, X Zhao, B Ballard, DC Hopkins 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2018 | 20 | 2018 |
| Results for an Al/AlN composite 350° C SiC solid-state circuit breaker module KP Bhat, YB Guo, Y Xu, T Baltis, DR Hazelmyer, DC Hopkins 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and …, 2012 | 16 | 2012 |
| Advanced multi-physics simulation for high performance power electronic packaging design X Zhao, Y Xu, DC Hopkins 2016 International Symposium on 3D Power Electronics Integration and …, 2016 | 11 | 2016 |
| FEA-based thermal-mechanical design optimization for DBC based power modules Y Xu, Z Xu, JW Eischen, DC Hopkins IEEE International Symposium on 3D Power Electronics Integration and …, 2016 | 6 | 2016 |
| A high performance power module with> 10kV capability to characterize and test in situ SiC devices at> 200 C ambient X Zhao, H Ke, Y Jiang, A Morgan, Y Xu, DC Hopkins Additional Papers and Presentations 2016 (HiTEC), 000149-000158, 2016 | 6 | 2016 |
| Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package H Ke, Y Xu, DC Hopkins International Symposium on Microelectronics 2013 (1), 000758-000763, 2013 | 6 | 2013 |
| Development of Advanced SiC Power Modules. Y Xu | 4 | 2017 |
| Ultra Low Leakage Module for 12kV-225 C SiC Semiconductor Testing X Zhao, H Ke, Y Jiang, A Morgan, Y Xu, DC Hopkins International Symposium on Microelectronics, Oct, 11-13, 2016 | 3 | 2016 |
| FEA-Based Thermal-Mechanical Optimization for DBC Based Power Modules Y Xu, D Hopkins | | |
