| A survey of carbon nanotube interconnects for energy efficient integrated circuits A Todri-Sanial, R Ramos, H Okuno, J Dijon, A Dhavamani, M Widlicenus, ... IEEE Circuits and Systems Magazine 17 (2), 47-62, 2017 | 22 | 2017 |
| A physics-based investigation of pt-salt doped carbon nanotubes for local interconnects J Liang, R Ramos, J Dijon, H Okuno, D Kalita, D Renaud, J Lee, ... 2017 IEEE International Electron Devices Meeting (IEDM), 35.5. 1-35.5. 4, 2017 | 9 | 2017 |
| Investigation of Pt-salt-doped-standalone-multiwall carbon nanotubes for on-chip interconnect applications J Liang, R Chen, R Ramos, J Lee, H Okuno, D Kalita, V Georgiev, ... IEEE Transactions on Electron Devices 66 (5), 2346-2352, 2019 | 8 | 2019 |
| Crossover from ballistic to diffusive thermal transport in suspended graphene membranes A El Sachat, F Könemann, F Menges, E Del Corro, JA Garrido, ... 2D Materials, 2019 | 8 | 2019 |
| Local thermometry of self-heated nanoscale devices F Menges, F Könemann (né Motzfeld), H Schmid, P Mensch, M Dittberner, ... 2016 IEEE International Electron Devices Meeting (IEDM), 15.8. 1-15.8. 4, 2016 | 8 | 2016 |
| Progress on carbon nanotube BEOL interconnects B Uhlig, J Liang, J Lee, R Ramos, A Dhavamani, N Nagy, J Dijon, ... 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 937-942, 2018 | 7 | 2018 |
| Thermal Conductivity of a Supported Multiwalled Carbon Nanotube F Könemann, M Vollmann, T Wagner, N Mohd Ghazali, T Yamaguchi, ... The Journal of Physical Chemistry C 123 (19), 12460-12465, 2019 | 6 | 2019 |
| Imaging the thermalization of hot carriers after thermionic emission over a polytype barrier F Könemann, IJ Chen, S Lehmann, C Thelander, B Gotsmann Physical Review Applied 13 (5), 054035, 2020 | 4 | 2020 |
| Nanoscale Scanning Probe Thermometry F Könemann, M Vollmann, F Menges, IJ Chen, NM Ghazali, T Yamaguchi, ... 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 4 | 2018 |
| Single‐Material Graphene Thermocouples A Harzheim, F Könemann, B Gotsmann, H van der Zant, P Gehring Advanced Functional Materials 30 (22), 2000574, 2020 | 3 | 2020 |
| Challenges and progress on carbon nanotube integration for beol interconnects B Uhlig, A Dhavamani, N Nagy, K Lilienthal, R Liske, R Ramos, J Dijon, ... 2018 IEEE International Interconnect Technology Conference (IITC), 16-18, 2018 | 3 | 2018 |
| Spatially resolved thermoelectric effects in operando semiconductor–metal nanowire heterostructures N Gächter, F Könemann, M Sistani, MG Bartmann, M Sousa, P Staudinger, ... Nanoscale 12 (40), 20590-20597, 2020 | 1 | 2020 |
| Method for fabricating a semiconductor device S Mauthe, M Sousa, F Konemann, KE Moselund US Patent App. 16/375,255, 2020 | | 2020 |
| Graphene Thermocouples: Single‐Material Graphene Thermocouples (Adv. Funct. Mater. 22/2020) A Harzheim, F Könemann, B Gotsmann, H van der Zant, P Gehring Advanced Functional Materials 30 (22), 2070137, 2020 | | 2020 |
| Single-Material Graphene Thermocouples P Gehring, A Harzheim, F Koenemann, B Gotsmann, HSJ van der Zant Advanced Functional Materials 30, n, 2020 | | 2020 |
| Scanning Probe Thermometry to study Thermoelectricity and Dissipation at Nanoscale Junctions F Könemann ETH Zurich, 2019 | | 2019 |
| Spatially resolved thermoelectric effects in semiconductor-metal heterostructures N Gächter, F Könemann, P Staudinger, B Gotsmann, M Sistani, ... | | |
Bernd GotsmannIBM Research - ZurichVerified email at zurich.ibm.com
