Följ
Jinzi Cui
Jinzi Cui
Okänd anknytning
Verifierad e-postadress på tigermail.auburn.edu
Titel
Citeras av
Citeras av
År
Reliability of Ag sintering for power semiconductor die attach in high-temperature applications
F Yu, J Cui, Z Zhou, K Fang, RW Johnson, MC Hamilton
IEEE Transactions on Power Electronics 32 (9), 7083-7095, 2016
1242016
Investigation of thick film technology for high temperature applications
Z Zhou, J Cui, F Yu, K Fang, Z Shen, RW Johnson, A Vert, T Zhang, ...
Additional Papers and Presentations 2012 (HITEC), 000184-000191, 2012
92012
Evaluation of thick-film materials for high-temperature packaging
Z Zhou, J Cui, F Yu, RW Johnson, MC Hamilton
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018
72018
Reliability of AuGe die attach on DBC substrates with different Ni surface finishes
J Cui, RW Johnson, MC Hamilton
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017
42017
Reliability of die attach on DBC substrates with different Ni surface finishes using BiAgX solder
J Cui, RW Johnson, MC Hamilton
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017
32017
Materials for High Temperature Electronic Packaging
J Cui
Auburn University, 2016
12016
Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability
J Cui, RW Johnson, MC Hamilton
Additional Papers and Presentations 2015 (HiTEN), 000073-000082, 2015
12015
Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-WP metallization in high temperature electronics interconnects
L Liu, J Cui, J Wang, Z Zhou, RW Johnson, C Liu
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 417-422, 2017
2017
Component Attachment with Pressureless Ag Sintering for 300° C Applications
F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton
Journal of Microelectronics and Electronic Packaging 13 (4), 155-162, 2016
2016
Component Attachment with Pressureless Sintering for 300° C Applications
F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton
Additional Papers and Presentations 2016 (HiTEC), 000226-000233, 2016
2016
Systemet kan inte utföra åtgärden just nu. Försök igen senare.
Artiklar 1–10